Laurell
H6-23
Wafer size
150mm
Power
95 to 240VAC, 47/63HZ, ~300 Watts[1]
What it is
How it works
The Laurell H6-23 uses a vacuum chuck to hold the substrate during rotation.[1][2][3]
The Laurell H6-23 has a maximum rotational speed of 12,000 RPM based on a ø 100 mm silicon wafer.[1][2][3]
The Laurell H6-23 uses a wireless tablet with Laurell Touch process control software, and the system can also be used with PC software named Spin 3000.[1][2][3]
Where it fits in the process flow
Applications
The Laurell H6-23 is used for semiconductor-related processing, biotechnology-related processing, and nanotechnology-related processing.[1][2][3]
The Laurell H6-23 supports manual and automatic dispense options.[1][2][3]
- Glove box use
- Coating
- Etching
- Developing
- Rinsing-Drying
- Cleaning
What do the numbers mean?
Power & electrical1
Wafer handling6
Configuration & options3
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Power95 to 240VAC, 47/63HZ, ~300 Watts[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What substrates does the Laurell H6-23 accommodate?
The Laurell H6-23 accommodates wafers up to ø 150 mm and substrates up to 5 inch by 5 inch.[1][2][3]
Not publicly documented
The following facts about the H6-23 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the H6-23 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the H6-23 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the H6-23 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the H6-23 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the H6-23 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]web.archive.org — web.archive.orgweb.archive.org
- [3]web.archive.org — web.archive.orgweb.archive.org
Last updated Oct 5, 2026.
Compare with similar tools
View all →
Laurell's WS-400-6NPP is a 400-series spin coater with a 400-series process controller, a 1.75" vacuum chuck, and support for wafers up to 150 mm.
The Laurell EDC-HL-23 B is a compact EDC spin processor with capacity for up to 150 mm wafers and 5 in x 5 in substrates.
The Laurell Lz-23 B is a compact 650-series spin coater that accommodates up to 150 mm wafers and 5 in × 5 in substrates.
The Laurell WS-650 is a spin coater used for spincoating photoresists.
