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Juki

KE 2050 RE

Assembly / SMTJuki KE 2050 RE family
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The Juki KE 2050 RE is a pick-and-place SMT machine. The Juki KE 2050 RE is used for small chip components, SOTs, and ICs. The Juki KE 2050 RE has a chip placement speed of 13,200 CPH.[1][2]

KE 2050 RE — Inventory photo
Fig. 01KE 2050 REInventory photo[1]

What it is

The Juki KE 2050 RE processes PCBs with dimensions of 510 by 360 millimeters. The machine achieves a placement speed of 13,200 chips per hour (CPH) under chip-placement conditions using laser centering. The placement accuracy is specified as plus or minus 0.05 millimeters with laser recognition.[1][2]

How it works

The machine supports laser recognition for components ranging from 0603 size up to 20 millimeter square packages or packages measuring 26.5 by 11 millimeters. An optional factory-installed upgrade allows handling of 0402 (01005) size components. The feeder system can accommodate up to 80 inputs on 8-millimeter tape feeders.[1][2]

Where it fits in the process flow

General reference — not yet source-verified

In an SMT assembly line, the pick-and-place machine is positioned after solder paste printing and before reflow soldering. The machine places components onto PCBs that have been printed with solder paste at a preceding printer station. Downstream, the loaded boards pass through a reflow oven to solidify the solder joints.

What do the numbers mean?

Optics & imaging7

13,200 CPH Chip (Laser Centering / Effective Tact)[1]
Accurate?
One Multi-nozzle Laser Head (4 Nozzles)[1]
Accurate?
Component Size Laser Recognition 0603 - 20 mm or 26.5 × 11 mm[1]
Accurate?
Placement Accuracy Laser Recognition ±0.05 mm[1]
Accurate?
Placement rate
13,200 CPH chip (laser centering / effective tact)[2]
Accurate?
Head
One multi-nozzle laser head (4 nozzles)[2]
Accurate?
Placement accuracy
Laser recognition ±0.05 mm[2]
Accurate?

Control & software2

Software[1]
Accurate?
Included items
SMD transport cart, feeder cabinet, feeder set, nozzle set, software[1]
Accurate?

Configuration & options17

SMD Transport Cart[1]
Accurate?
Feeder Cabinet[1]
Accurate?
Feeder Set[1]
Accurate?
Nozzel Set[1]
Accurate?
Higher Volumes Small Chip Components SOTs and ICs[1]
Accurate?
From 0603 0201 to 20mm Square Components or 26.5 × 11 mm 0402 (01005) Option Factory Installed[1]
Accurate?
Main Features of SMT Pick and Place Machine[1]
Accurate?
Pcb (510×360mm)[1]
Accurate?
(0402 (01005) optional) (2)[1]
Accurate?
Placement Speed Chip 13,200C PH[1]
Accurate?
Feeder Inputs Max. 80 on 8 mm T / F[1]
Accurate?
1 Effective Tact the Chip Placement Speed Indicates an Estimated value Obtained when the Machine Places 400 1608 Chips All over an M Size Board[1]
Accurate?
(CPH number of components placed for one hour)[1]
Accurate?
Machine type
Pick-and-place SMT machine[2]
Accurate?
Component size recognition
0603 - 20 mm or 26.5 × 11 mm[2]
Accurate?
Feeder inputs
Max. 80 on 8 mm T / F[2]
Accurate?
PCB size
510 × 360 mm[1]
Accurate?
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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What is the placement speed of the Juki KE 2050 RE?

The Juki KE 2050 RE achieves 13,200 chips per hour (CPH) for chip components when using laser centering under effective tact conditions.[1][2]

What component sizes can the KE 2050 RE handle?

With laser recognition, the machine handles components from 0603 size up to 20 millimeter square packages or packages measuring 26.5 by 11 millimeters. An optional factory-installed upgrade enables handling of 0402 (01005) size components.[1][2]

What is the placement accuracy of the KE 2050 RE?

The placement accuracy is plus or minus 0.05 millimeters with laser recognition.[1][2]

What kind of pick-and-place head does the KE 2050 RE use?

The machine uses one multi-nozzle laser head with four nozzles.[1][2]

Not publicly documented

The following facts about the KE 2050 RE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the KE 2050 RE are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the KE 2050 RE are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the KE 2050 RE are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the KE 2050 RE are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the KE 2050 RE is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
  3. [3]Equipment inventory listing
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Last updated Oct 11, 2026.

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