Waferpedia

YES

PB12

Thermal / Diffusion300mmYES PB12 family
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YESPB12
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Wafer size

300mm

Vacuum

high vacuum (10^-5)[1]

What it is

General reference — not yet source-verified

Vacuum cure ovens are batch thermal processing systems used in semiconductor and MEMS manufacturing to apply controlled heating under vacuum or inert atmosphere for processes such as polymer curing, metal annealing, and dehydration.

What can it run?

Process applications and technology nodes documented for this tool.

  • MEMS and semiconductor process applications
  • Wafer dehydration
  • Getter activation
  • Metal annealing
  • Thermal treatment of thin film resistors

What do the numbers mean?

Vacuum & pumping1

Vacuum
high vacuum (10^-5)[1]2 sources
Accurate?

Wafer handling2

Wafer size
up to 300mm wafers[1]
Accurate?
Wafer size
up to 300mm[1]
Accurate?

Configuration & options3

Series
PB-HV Series (manual load)[1]
Accurate?
Model designation
PB12 High Vac Specs[1]
Accurate?
Maximum temperature
up to 450°C[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
YES-PB8 High Vac Specs——up to 200mm wafersweb.archive.org[1]
YES-PB12 High Vac Specs——up to 300mm wafersweb.archive.org[1]
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What replaced it?

  • siblingYES PB8— The PB-HV series page lists YES-PB12 High Vac Specs (up to 300mm wafers) alongside the PB8.source[1]

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Vacuumhigh vacuum (10^-5)[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the PB12 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PB12 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the PB12 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the PB12 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the PB12 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the PB12 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]PB12 — YES | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
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Last updated Sep 22, 2026.

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