Thermal / Diffusion

The Tokyo Electron A 8 S ZA is a PoCl3 furnace with an EPROM based control system.

The YES 12-2P-CP is a manual-load high-temperature cure oven for MEMS and semiconductor process applications.

YES-3TA is a Vacuum Bake / Vapor Prime system in the YES Vacuum Bake/Vapor Prime product line, with capacity for 8 cassettes of 4-inch wafers or 1 cassette of 5-8 inch wafers.

The Despatch LCD1-16NV-3 is an oven for polymer curing with nitrogen circulation, a HEPA filter, and temperature monitoring capability.

The Samsung Galaxy S 4G is a smartphone released in February 2011 with a 4.0-inch Super AMOLED display, 1 GHz Hummingbird processor, and 5 MP camera.

The Tenney Thermal Shock Jr Thermal Shock Chamber is a thermal shock chamber with an 11" L × 5.5" W × 5" H basket and a temperature range of -70 °C to +200 °C.

The Heller 1707 MK7 is an ISO-certified reflow oven system with 7 heated zones, 1 cool zone, and options for air or nitrogen process gas.

The Veeco LSA101 is a Laser Spike Annealing System used for precision doping of materials at a controlled temperature in semiconductor manufacturing.

The BTU Pyramax 98 is a forced convection lead-free reflow oven with up to 7 heated zones and a 350°C maximum operating temperature.

The Lindberg/Blue M Tube Furnace is a family of laboratory tube furnaces including the Mini-Mite series (models TF55030A, TF55030C, etc.) with a maximum temperature of 1100°C and the STF55433 model rated for 1500°C.

General referenceThe Blue M OV 500 C 2 is a forced convection oven used for thermal processing applications in laboratory and industrial settings.

The Heller 1088 is a forced-convection SMT reflow oven designed for medium- to high-volume PCB assembly.

The Palomar 1200 is a eutectic die attach oven.

The Axcelis Fusion M 200 PC is a UV cure system for semiconductor wafer processing.

The Lindberg / Blue M GO 1300 A Gravity Oven is a convection oven with a temperature range of 40°C to 200°C.

The SCREEN/DNS LA 820 is a rapid thermal processing (RTP) system for rapid annealing of wafers up to 8 inches.

The Blue M 0 500 is an oven manufactured by Blue M, with asset number 139866.

The Varian VHS 250 is a diffusion pump used for high vacuum applications.

The Tokyo Electron Alpha 8 S ZC is a furnace for 8-inch wafers used for nitride processing.

The Heller 1809 MK III SMT is a reflow oven for SMT soldering applications.

The Hitachi Kokusai DD 812 V is a diffusion system designed for N2 anneal processing of 6-inch wafers.

The Tokyo Electron Alpha 8 S is a vertical furnace for 8-inch wafers, configured for ATM Oxide processes.

The Blue M IGF 6680 F is an inert gas cure oven.

The Axcelis Fusion M 200 PCU UV Cure System is a UV cure system designed for 8-inch wafers.

The Blue M MO 1440 A 1 is a reliability oven manufactured by Blue M.

The Tokyo Electron Alpha 8 SE Z is an oxidation furnace configured for 8-inch wafers.

The Thermo Fisher Scientific Precision 29 is a thermal/diffusion oven.

The Blue M WSP 109 C MP 3 is a hot and cold oven.

The Heller 1913 MKIII is a reflow oven used for soldering electronic components onto printed circuit boards.

The SUSS ACS 300 Gen 2 is a coater/developer system.

The Heller 1809 MK III is a reflow oven.

Applied Materials Producer GT 3 RTP is a rapid thermal process system for 12-inch wafers.

Model 1518 is a dual-function ultra-clean system for HMDS prime and image reversal with stated capacities for 4-inch through 8-inch wafer cassettes.

The YES PBX4-300 is a fully automated 300mm and 200mm polyimide/BCB/copper anneal and vacuum bake system from Yield Engineering Systems.

The Herareus UT 6120 Drying is a drying oven manufactured by Thermo Scientific / Herareus (Thermo Fisher) and categorized under Thermal / Diffusion.

The Samsung Galaxy S2 Skyrocket is a smartphone with a 4.5-inch Super AMOLED Plus display, powered by a Qualcomm Snapdragon S3 chipset, and runs Android 2.3.5 Gingerbread upgradable to 4.1.2 Jelly Bean.

Samsung is a South Korean multinational conglomerate founded in 1938.

The Tokyo Electron Alpha 303 i K is a 12-inch-wafer furnace in the Thermal / Diffusion category, documented in MTO and DCS-MTO configurations.

The Canon BCOS V is an in-line curing oven.

The Blue M IGF 77806 MP is an oven used for silicon heat treat.

The Heller 1809 EXL is a forced convection reflow oven for soldering surface-mount components, featuring 9 top and 9 bottom heating zones, dual-zone active cooling, and temperature control accuracy of ±0.1°C, capable of handling board widths up to 23.5 inches.

The SVG Thermco 5204 Diffusion Furnace is a thermal diffusion system for 150 mm (6 inch) wafers with a 40 inch flat zone.

Tokyo Electron Formula is a furnace with source-listed 12-inch wafer size and applications including TEOS, HF, F2, DCS, NH3, and SiN.

The Heller 1707 MK 5 is a reflow oven, also described as an oven, with a 400 V supply that can convert to 220 V.

The Tokyo Electron Formula Diffusion is a diffusion furnace for thermal processing, with a variant supporting 300 mm wafers and an aluminium oxide process.

The Blue M 1200 C Box Furnace is a programmable high-temperature box furnace used for thermal processing of wafers and samples in a laboratory cleanroom environment.

The Yes 450 PB 8-4 is an oven.

The Thermotron SE 600 13 13 is a temperature chamber with a 20.7 ft³ workspace volume.

The Blue M POM 323 GXX is an oven used in semiconductor manufacturing.

The YES 450 PB 8 Polyimide Bake Oven is a nitrogen/vacuum oven designed for polyimide curing and handling up to two cassettes of 8-inch wafers.