YES
6-2P-CP
What it is
The YES 6-2P-CP is a manual-load high-temperature vacuum cure oven manufactured by Yield Engineering Systems. The machine belongs to the YES-PB Series of polyimide cure ovens designed for batch processing of semiconductor wafers and MEMS devices.[1]
How it works
The YES-PB Series ovens use vertical laminar airflow to carry particulates away from wafers, directing air from the top of the chamber and out the bottom to reduce turbulence. A coalescing condensate trap collects solvent vapors that condense during the cure process, preventing plugging of vacuum lines and protecting pump performance.[2][1]
The oven incorporates a cooling package that uses only air, not water, to control chamber cooling rates. The design allows adjustment of the air mixing ratio to achieve uniform temperature distribution and controlled ramp-down rates over a broad range of operating temperatures.[2][1]
The YES-PB Series ovens maintain a dry inert atmosphere with extremely low oxygen concentrations. The process chamber supports vacuum operation for removal of residual solvents and moisture, and the system includes a touch-screen interface for automated recipe control.[1]
Applications
The YES-PB Series ovens are used for curing polyimide and PBO in wafer-level packaging and redistribution layer applications. Other applications include BCB bake, low-temperature polymer cure, copper anneal, low-k dielectric cure, copper oxide removal, and aluminum anneal.[1]
The ovens are also employed for dehydration bake, surface modification, and vapor phase deposition processes such as silane coating and adhesion promotion for MEMS and advanced packaging.[1]
- Polyimide bake
- BCB bake
- Copper anneal
- Low-K dielectric cure
- Copper oxide removal
- Aluminum anneal
- Polyimide/PBO cure
- Polyimide cure/bake/anneal
- Dehydration bake
What do the numbers mean?
Vacuum & pumping1
- Atmosphere/process control
- dry inert atmosphere, pressure control, uniform temperature distribution, control of heating and cooling rates[1]
Wafer handling2
Configuration & options6
Vintage & configurations
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Atmosphere/process controldry inert atmosphere, pressure control, uniform temperature distribution, control of heating and cooling rates[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the 6-2P-CP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6-2P-CP are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 6-2P-CP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 6-2P-CP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 6-2P-CP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 6-2P-CP are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]web.archive.org — web.archive.orgweb.archive.org
Last updated Aug 13, 2026.
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