Waferpedia

Comparison ledger

0 V 500versus6-2P-CP

Blue M 0 V 500, YES 6-2P-CP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0 V 500Blue M
OEMBlue MYES
CategoryThermal / DiffusionThermal / Diffusion
Wafer size—150mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlue M 0 V 500YES 6-2P-CP
Cited variants—
Specifications
Series—PB Series (manual load)[2]
Model—6-2P-CP[1]
Wafer size—150 mm wafers[1]
Process type—high temperature cure oven[2]
Operation—manual load[2]
Atmosphere/process control—dry inert atmosphere, pressure control, uniform temperature distribution, control of heating and cooling rates[2]
Cooling package—air only, no water[2]
Airflow—vertical laminar airflow[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org