Tegal
A plasma asher or plasma etcher is a semiconductor process machine that uses a plasma environment to remove material from a wafer surface or to strip organic films. The Tegal Plasmaline 411 belongs to that class of vacuum-based process equipment.
A plasma processing tool ionizes process gas inside a chamber and uses the reactive species to modify or remove material at the wafer surface. A resist-processing configuration uses that mechanism to strip photoresist and related organic residues after lithography or etch steps.
Resist processing sits in the fabrication flow after lithographic pattern transfer or other steps that leave organic residues on the wafer. The process removes resist or residue before the wafer moves to the next clean, inspection, or patterning operation.
Plasma ashers and etchers are commonly used in semiconductor manufacturing for photoresist removal, residue cleaning, and dry process steps on wafer surfaces. The same class of equipment is also used where a dry, chemical-reaction-based alternative is needed instead of liquid cleaning.
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The Tegal Plasmaline 411 is a plasma asher and plasma etcher associated with resist processing.[1]
The following facts about the Plasmaline 411 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Plasmaline 411 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Plasmaline 411 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Plasmaline 411 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Plasmaline 411 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Plasmaline 411 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 3, 2026.
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