Tegal
6520
The Tegal 6520 HRe is a high-density CCP plasma etch tool. The Tegal 6520 HRe features dual-frequency RF power application and magnetic plasma confinement. The Tegal 6520 HRe supports wafer sizes from 100mm to 200mm.[1][2]
What it is
How it works
Where it fits in the process flow
The Tegal 6520 HRe is used for repeated etch steps in integrated-circuit and related microelectronics manufacturing.[3]
Applications
The Tegal 6520 HRe is used for sub-micron aluminum alloy interconnect stack etch and anisotropic thick aluminum alloy interconnect etch.[1][2][3]
The Tegal 6520 HRe is used for HBT and HEMT gate mesa etch and recess etch.[1][2][3]
- sub-micron aluminum alloy interconnect stack etch
- anisotropic thick (>2 micron) aluminum alloy interconnect etch
- HBT/HEMT gate mesa and recess etch
- gallium arsenide (GaAs) etching in the production of telecom devices
- other III-V material etch applications
What do the numbers mean?
Power & electrical1
Wafer handling1
Configuration & options4
Vintage & configurations
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- RF powerdual-frequency RF power application[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How is etch uniformity controlled on plasma etchers?General reference — not yet source-verified
Uniformity is managed through careful design of the process chamber, gas distribution, electrode geometry, temperature control, and plasma parameters. Regular characterization using test wafers allows process engineers to adjust conditions to maintain consistent results.
What materials can be etched with this class of equipment?General reference — not yet source-verified
Plasma etch systems are generally capable of etching a wide range of materials used in semiconductor devices, including dielectrics such as oxides and nitrides, polysilicon, and various metals. The specific chemistry depends on the material to be removed and the selectivity required to the mask and underlying layers.
What are common concerns when operating plasma etch equipment?General reference — not yet source-verified
Common concerns include process repeatability, particle control, chamber cleanliness, endpoint detection, and maintenance of consumable components that wear or become coated during operation.
Not publicly documented
The following facts about the 6520 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the 6520 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 6520 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 6520 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 6520 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 6520 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]web.archive.org — web.archive.orgweb.archive.org
- [3]web.archive.org — web.archive.orgweb.archive.org
Last updated Oct 5, 2026.
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