Waferpedia

Tegal

903

Etch100mmIntroduced Tegal 903 family
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The Tegal 903 ACS is a diode plasma etch tool. The Tegal 903 ACS has a wafer size range of 3", 100mm – 150mm. The Tegal 903 ACS is suited to plasma etch of silicon oxide and silicon nitride materials.[1]

903 — web.archive.org
Fig. 01903web.archive.org[2]

Wafer size

100mm

Introduced

2000

Power

narrow gap RF diode reactor[1]

How it works

The reactor does not require wafer clamps or electrostatic chucks. The system incorporates a production-proven transport system that moves substrates through the process chamber.[1][3]

Where it fits in the process flow

Applications include pad passivation etch, oxide contact and via etch down to 0.8 micron, LDD spacer etch, polyimide interlayer dielectric etch, and resist or spin-on-glass planarization. The system is used in both front-end-of-line and back-end-of-line processes.[3][2]

What can it run?

Process applications and technology nodes documented for this tool.

  • non-critical via etch
  • pad passivation etch
  • oxide contact/via etch
  • LDD spacer etch
  • polyimide ILD etch
  • resist/SOG planarization
  • etching oxide contacts
  • production of memory chips
  • production of data communication ICs
  • production of microcontrollers
  • production of multimedia ICs
  • production of power management devices

What do the numbers mean?

Power & electrical2

Reactors/materials
narrow gap RF diode reactor; plasma etch of silicon oxide and silicon nitride materials[1]
Accurate?
Reactor type
narrow gap RF diode reactor[1]
Accurate?

Wafer handling6

Wafer size support
75-150 mm round silicon and GaAs substrates; rectangular substrates from 100-125 mm on a side[3]
Accurate?
Wafer size support
3", 100mm–150mm[1]
Accurate?
Wafer size
3", 100mm – 150mm[1]
Accurate?
Substrate range
75–150 mm round silicon and GaAs substrates; rectangular substrates from 100–125 mm on a side[3]
Accurate?
Round substrate range
75-150 mm round silicon and GaAs substrates[3]
Accurate?
Rectangular substrate range
100-125 mm on a side[3]
Accurate?

Configuration & options3

Tool type
diode plasma etch tool[3]
Accurate?
Materials
silicon oxide and silicon nitride[1]
Accurate?
Transport system
Production-proven transport system[3]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
903 ACS———web.archive.org[1]
903e———web.archive.org[2]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Reactors/materialsnarrow gap RF diode reactor; plasma etch of silicon oxide and silicon nitride materials[1]
  • Reactor typenarrow gap RF diode reactor[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What type of reactor does the Tegal 903 use?

The Tegal 903 uses a narrow gap RF diode reactor.[1]

What are typical applications for the Tegal 903?

Typical applications include pad passivation etch, oxide contact/via etch (down to 0.8 micron), LDD spacer etch, polyimide ILD etch, and resist/SOG planarization. The system is also used for MEMS, advanced packaging, thin film head, and Bio-Chip nanotechnology.[1][3]

What substrate sizes does the transport system handle?

The transport system can accommodate 75 to 150 millimeter round silicon and GaAs substrates, and can be configured for rectangular substrates from 100 to 125 millimeters on a side.[3][2]

Not publicly documented

The following facts about the 903 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 903 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 903 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 903 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 903 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 903 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]web.archive.org — web.archive.orgweb.archive.org
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Last updated Oct 5, 2026.

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