SUSS MicroTec
Delta 12 AQ
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
Wafer size
Wafer Developing System Configuration
Gas delivery
AZ400K, AZ300MIF, CD26[2]
Optics
125 mm x 125 mm, 150 mm x 150 mm[2]
What it is
The SUSS MicroTec Delta 12 AQ is an automated photoresist developer station.[2]
The Delta 12 AQ supports temperature controlled spray photoresist development.[2]
The Delta 12 AQ provides cassette-to-cassette substrate operation for a "dry in – dry out" process.[2]
The SUSS Delta 12 AQ is a machine that processes a variety of substrates using standard developer chemistries.[2]
How it works
Where it fits in the process flow
The Delta 12 AQ performs photoresist development after optical exposure.[2]
The Delta 12 AQ handles substrates with a maximum diameter of 200 mm (8 in) and a maximum substrate thickness of 5 mm.[2]
The Delta 12 AQ supports wafer diameters of 50 mm (2 in), 75 mm (3 in), 100 mm (4 in), 150 mm (6 in), and 200 mm (8 in).[2]
The Delta 12 AQ supports photomask sizes of 125 mm x 125 mm and 150 mm x 150 mm.[2]
Applications
The SUSS MicroTec Delta 12 AQ is used for photoresist development after optical exposure.[2]
What do the numbers mean?
Wafer handling8
Gas & chemistry2
- Coaters & Developers Vintage
- 2009(inventory listing)
Optics & imaging1
Control & software2
- Software is not included[1]
Configuration & options4
- Vintage
- 2009(inventory listing)
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Supported developer chemistriesAZ400K, AZ300MIF, CD26[2]
- Coaters & Developers Vintage2009
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How is resist thickness uniformity achieved?General reference — not yet source-verified
Uniformity is achieved through precise control of spin speed, acceleration, and dispensing conditions. The spin coating process uses centrifugal force to level the resist, and modern systems actively monitor and adjust parameters to maintain thickness variations within tightly specified tolerances across the entire substrate.
What substrate sizes can be handled?General reference — not yet source-verified
Resist processing tools are designed to handle standard semiconductor substrate sizes, ranging from smaller research-scale wafers to larger production wafers. The specific sizes supported depend on the machine configuration, but the class generally covers all common wafer diameters used in microelectronics manufacturing.
How does this equipment contribute to process consistency?General reference — not yet source-verified
Process consistency is ensured through programmable recipes, automated wafer handling, and closed-loop control of temperature, spin speed, and dispense volume. Modern systems also incorporate features such as chemical recirculation, environmental isolation, and diagnostic routines that help maintain repeatable film properties across batches and over time.
Not publicly documented
The following facts about the Delta 12 AQ are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Delta 12 AQ are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Delta 12 AQ are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Delta 12 AQ are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Delta 12 AQ are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Delta 12 AQ is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]nist.gov — nist.govnist.gov
- [3]suss.com — suss.com (Mar 23, 2006)web.archive.org
Last updated Oct 9, 2026.
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