Esec
Esec 2009 SSI E
The Esec 2009 SSI E is a die bonder platform. The Esec 2009 SSI E supports epoxy die attach applications. The Esec 2009 SSI E supports wafer sizes from 4" to 12" on 8" or 12" wafer frames.[1]
Wafer size
4"
Performance
20 µm @ 3σ (15 µm option)[1]
What it is
The Esec 2009 SSI E is a die bonding machine for packaging and bonding workflows.[1]
How it works
General reference — not yet source-verifiedDie bonding machines pick a die from a source location, place it at a target location, and then execute the bonding step that secures the die in position.
Where it fits in the process flow
General reference — not yet source-verifiedDie bonding sits in the assembly flow after wafer singulation or die provision and before later packaging operations.
A die bonder places the chip onto a leadframe, substrate, or other package element before the assembly moves to subsequent interconnect, encapsulation, or finishing steps.
Applications
The Esec die bonding family covers epoxy die attach applications used in semiconductor packaging.[1]
- TSOP
- FBGA
- epoxy die attach applications
What do the numbers mean?
Wafer handling1
Performance1
Dimensions & facilities2
Configuration & options3
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Esec 2009 SSI E | — | — | — | besi.com[1] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the Esec 2009 SSI E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Esec 2009 SSI E are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Esec 2009 SSI E are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Esec 2009 SSI E are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Esec 2009 SSI E is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Esec 2009 SSI E are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
Last updated Oct 5, 2026.
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