Datacon 2200 evo advanced

Die bonders perform the task of picking singulated dies from a wafer or other carrier and placing them onto a substrate, such as a leadframe, a laminate, or another die, with precise alignment and controlled bonding force. The Datacon 2200 evo advanced is one variant of a platform that offers scalability of performance and process capabilities.

The Datacon 2200 evo advanced uses a pick-and-place mechanism to transfer dies from a wafer or tape to a bonding site. The system typically incorporates a multi-module architecture, allowing multiple bond heads to operate in parallel or independently to increase throughput. Vision systems align the die and substrate to achieve precise placement. The bond head applies a controlled force and may use heat or ultrasonic energy to attach the die, depending on the process material.

Machine operation includes wafer handling to present dies to a pick-up station, where a collet or a bonding tool lifts the die from the wafer tape. After picking, the die is transported to the bonding position where it is placed onto the substrate. The die attach process can use adhesives such as epoxy or solder, or it may involve direct bonding techniques like eutectic or thermo-compression bonding. The system includes automated material handling for substrates, such as magazines or strips.

In multi-die packaging, the Datacon 2200 evo advanced can place multiple dies onto a single substrate, enabling system-in-package or multi-chip module configurations. The machine is typically positioned downstream from wafer preparation and upstream of inspection or wire bonding stations.