Esec
Datacon 2200 evo hF
The Esec Datacon 2200 evo hF is a die bonder. The Esec Datacon 2200 evo hF is the 3rd generation of Besi's most flexible 300 mm high-speed platform. The Esec Datacon 2200 evo hF supports wafer sizes from 4" to 12" on 8" or 12" wafer frames.[1]
Plate 01BESI Datacon Die Bonder/bonding machine: datacon 2200 evo/8800 FC Quantum
GEEKVALUE SMT SolutionsWatch on YouTubePlate 02Besi Datacon 2200 evo and Datacon 8800 Series die bonder /die bonding machine
GEEKVALUE SMT SolutionsWatch on YouTubePlate 03Datacon 2200 EVO Demo Video
Ollie Dunne Tara SemiWatch on YouTubePlate 04Auto calibration Datacon 2200 evo plus
HJ Tech SolutionsWatch on YouTube
Wafer size
4"
Performance
20 µm @ 3σ (15 µm option)[1]
What it is
The Datacon 2200 evo hF is a die bonder for packaging and bonding applications.[3]
How it works
The Datacon 2200 evo hF uses integrated dispenser functions, multiple pick-and-place and eject tools, I/O systems, and application-specific options.[3]
Where it fits in the process flow
Applications
The Datacon 2200 evo hF is used for Power Modules, IGBT, MCM, and SiP applications.[3]
The Datacon 2200 evo hF supports epoxy, soldering, thermo-compression, and eutectic processes.[1]
- epoxy die attach
- TSOP
- FBGA
What do the numbers mean?
Wafer handling6
Performance3
Dimensions & facilities4
Configuration & options16
Vintage & configurations
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the Datacon 2200 evo hF are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Datacon 2200 evo hF are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Datacon 2200 evo hF are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Datacon 2200 evo hF are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Datacon 2200 evo hF is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Datacon 2200 evo hF are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
- [2]semiconductor.directorysemiconductor.directory
- [3]besi.com — besi.combesi.com
Last updated Oct 7, 2026.
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