Waferpedia

Tool family

Esec Esec 2009 SSI E

EsecPackaging & Bonding1 entry

The Esec 2009 SSI E is a die bonder platform in the Packaging & Bonding category. The Esec 2009 SSI E supports epoxy die attach applications and wafer sizes from 4" to 12" on 8" or 12" wafer frames.

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Models in this family

  1. Esec 2009 SSI E3rd generation

    The Esec 2009 SSI E is a die bonder platform in the Packaging & Bonding category. The Esec 2009 SSI E supports epoxy die attach applications and wafer sizes from 4" to 12" on 8" or 12" wafer frames.

    Cited variants

    DesignationGenerationVintageChangesSource
    Esec 2009 SSI E———besi.com[1]

Sources

Sources (1)Every fact above is drawn from these public sources
  1. [1]besi.combesi.com