ERSA
Versaflow 40 50 Selective Soldering
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ERSA Versaflow 40/50 is a selective soldering machine for printed circuit board assembly. The Versaflow 40/50 features a single-point high-precision solder wave with a smallest nozzle diameter of 4.5 mm and a stainless steel solder pot integrated in a 3-axis positioning system.[1]
What it is
How it works
The ERSA Versaflow 40 50 Selective Soldering uses a selective spray fluxer, bottom-side infrared preheating, and a selective mini-wave soldering module. The machine uses servo-driven positioning axes for fluxing and soldering, and the solder module uses a single-point high-precision solder wave.[1]
The ERSA Versaflow 40 50 Selective Soldering supports nitrogen injection over the solder bath and records process data through industrial-PC control.[1]
Where it fits in the process flow
General reference — not yet source-verifiedSelective soldering belongs in electronic assembly after board placement and before final inspection or test. The machine is used for boards that need solder joints formed at specific locations without soldering the entire assembly in one pass.
Applications
General reference — not yet source-verifiedSelective soldering is used for electronic assemblies that require localized solder joints on printed circuit boards. The process is suited to mixed assemblies where solder must be applied to specific through-hole or board-area locations rather than to the full board.
What do the numbers mean?
Power & electrical2
Vacuum & pumping3
Performance2
Dimensions & facilities7
Configuration & options15
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Versaflow 40 50 Selective Soldering are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Versaflow 40 50 Selective Soldering are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Versaflow 40 50 Selective Soldering are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Versaflow 40 50 Selective Soldering are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Versaflow 40 50 Selective Soldering are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Versaflow 40 50 Selective Soldering is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]ibesmt.com — ibesmt.comibesmt.com
- [2]Inventory photo
- [3]Versaflow 40 50 Selective Soldering — ERSA | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 1, 2026.
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