YES
CV200 RFS
The YES CV200 RFS Plasma Strip / Descum System is a plasma-based tool for removing thick photoresist or polyimide layers. The YES CV200 RFS operates in plasma stripping and descum modes. The YES CV200 RFS achieves resist removal rates up to 7000 angstroms per minute.[1]
Wafer size
50mm
Power
Variable Power Supply from 150 W to 1250 W[1]
Gas delivery
Up to 7000 angstroms per minute[1]
What it is
The YES CV200 RFS is a plasma strip and descum system used in semiconductor manufacturing.[1]
The YES CV200 RFS removs thick layers of photoresist or polyimide in short production times.[1]
The YES CV200 RFS is designed to meet the strict requirements of contemporary front-end semiconductor processing equipment.[1]
How it works
The YES CV200 RFS operates in two main modes.[1]
A powerful plasma stripping mode removes tough and thick resists.[1]
A gentler descum mode cleans inorganic substrates.[1]
The YES CV200 RFS uses a unique downstream protective design that balances the charge in the plasma to shield the product from damaging UV exposure.[1]
The YES CV200 RFS has a variable power supply from 150 W to 1250 W.[1]
The YES CV200 RFS provides real-time wafer temperature measurement and flexible temperature control.[1]
The YES CV200 RFS has multiple process gas inputs.[1]
Where it fits in the process flow
The YES CV200 RFS handles wafers from 50 mm to 200 mm.[1]
Applications
The YES CV200 RFS is used for photoresist removal.[1]
The YES CV200 RFS is used for polyimide removal.[1]
The YES CV200 RFS is used for organics removal.[1]
The YES CV200 RFS is used for descum processes.[1]
- Photoresist removal
- Polyimide removal
- Organics removal
- Descum processes
What do the numbers mean?
Power & electrical2
Wafer handling3
Gas & chemistry2
Control & software1
Configuration & options2
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the removal rate for photoresist with the YES CV200 RFS?
The YES CV200 RFS provides quick resist removal, up to 7000 angstroms per minute.[1]
What wafer sizes does the YES CV200 RFS support?
The YES CV200 RFS supports wafers from 50 mm to 200 mm.[1]
What is the power range of the YES CV200 RFS?
The YES CV200 RFS has a variable power supply from 150 W to 1250 W.[1]
Not publicly documented
The following facts about the CV200 RFS are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CV200 RFS are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the CV200 RFS are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the CV200 RFS are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the CV200 RFS are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the CV200 RFS is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]pnf.uchicago.edu — pnf.uchicago.edupnf.uchicago.edu
- [2]Resource Scheduler & Rates | Colorado Shared Instrumentation in Nanofabrication and Characterization (COSINC) | Universi — colorado.educolorado.edu
- [3]Photoresist stripper [YES-ash] | Quantum-Nano Fabrication and Characterization Facility | University of Waterloo — uwaterloo.cauwaterloo.ca
- [4]Yield Engineering Systems, Inc. > Products > Plasma Strip/Descum Systems > CV200RF Series — yieldengineering.com (Mar 29, 2012)web.archive.org
Last updated Sep 21, 2026.
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