Comparison ledger
Hitachi 1305 BSG 3, YES CV200 RFS, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1305 BSG 3Hitachi | CV200 RFSYES |
|---|---|---|
| OEM | Hitachi | YES |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | 50mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hitachi 1305 BSG 3 | YES CV200 RFS |
| Specifications | ||
| Process | — | Plasma strip / descum system[1] |
| Wafer size | — | 50 mm to 200 mm[1] |
| Power supply | — | Variable Power Supply from 150 W to 1250 W[1] |
| Resist removal rate | — | Up to 7000 angstroms per minute[1] |
| Temperature measurement | — | Real-time wafer temperature measurement[1] |
| Temperature control | — | Flexible temperature control[1] |
| Gas inputs | — | Multiple process gas inputs[1] |
| Design | — | Unique downstream protective design[1] |
| Wafer size range | — | 50 mm to 200 mm[1] |
| Power supply range | — | 150 W to 1250 W[1] |
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