SVG
8800
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The SVG 8800 is a single-track photoresist coater and developer used in semiconductor lithography. The SVG 8800 can process 6 inch and 8 inch wafers. The SVG 8800 has a brushless spindle motor with acceleration up to 50,000 RPM/second.[1][2][3]
What it is
The SVG 8800 is a coater and developer track system for semiconductor wafers. The SVG 8800 applies photoresist coatings and performs development of the resist after exposure. Configurations of the SVG 8800 handle 6-inch and 8-inch wafers. An 8-inch-wafer configuration provides dual coat with soft bake. A 6-inch-wafer configuration is set up for edge bead removal and backside cleaning.[2][3][4][1]
How it works
The coater section of the SVG 8800 is a single-track photoresist spinner with a programmable dispense-arm motion. Automatic cassette wafer handling is standard, with dual load and unload capability. The SVG 8800 uses a high-acceleration brushless spindle motor. The dispense arm can be programmed to sweep or remain stationary, for either photoresist dispense or edge bead removal. The SVG 8800 has a top nozzle for edge bead removal and a bottom nozzle for backside rinse.[1]
The SVG 8800 has a hot-plate oven next to the resist spinner that can be programmed for temperatures up to 300 C. The developer section is a spinner cup with a pressurized dispense nozzle on top. The wafer can be processed dynamically or statically during development. After development, a deionized-water rinse cleans the wafer, and the wafer is spun dry. The wafer then travels to a hot-plate oven that can be programmed for temperatures up to 300 C.[1]
Applications
The SVG 8800 is used for positive photoresist coating and development. The system has a top nozzle for edge bead removal and a bottom nozzle for backside rinse. A 6-inch-wafer configuration is set up for edge bead removal and backside cleaning. An 8-inch-wafer configuration provides dual coat with soft bake.[3][4][1]
What do the numbers mean?
Wafer handling7
Gas & chemistry10
Configuration & options15
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Dual Coat with Soft Bake | — | — | Configured for 8 inch wafers and includes dual coat and soft bake capability. | Equipment inventory listing[3] |
| 3-Resist Configuration with EBR and Backside Cleaning | — | — | Set up for 6 inch wafers with three resist lines, edge bead removal, and backside cleaning. | Equipment inventory listing[4] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Configuration3 Resist[4]
- TypeSingle-track coater and developer[1]
- Developer dispense typePressurized nozzle[1]
- Developer modeDynamic or static[1]
- Developer rinseDI water rinse[1]
- Coater/Developer typePhotoresist coating and developing[1]
- Configuration3 resist lines, EBR, backside cleaning[4]
- Developer TypeSingle track with pressurized dispense nozzle[1]
- Equipment typeCoater / Developer[2]
- Operating modeSingle track dispense photoresist spinner[1]
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- Archived Process ManualsManualberkeley.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the SVG 8800 support?
What is the maximum acceleration of the coater spindle?
The coater spindle can accelerate at 50,000 rpm per second.[1]
What temperature can the hot plate ovens reach?
The hot plate ovens can be programmed for temperatures up to 300 °C.[1]
Does the SVG 8800 support edge bead removal (EBR)?
Yes, the SVG 8800 has a top nozzle for edge bead removal and can be configured for EBR.[1][4]
Can the SVG 8800 perform dual coat and soft bake?
Yes, the SVG 8800 can be set up for dual coat with soft bake.[3]
Is the SVG 8800 a single-track system?
Yes, the SVG 8800 is a single-track dispense photoresist spinner and single-track developer.[1]
Not publicly documented
The following facts about the 8800 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 8800 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 8800 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 8800 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 8800 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 8800 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]nanolab.ucla.edu — nanolab.ucla.edunanolab.ucla.edu
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Archived Process Manuals — nanolab.berkeley.edunanolab.berkeley.edu
Last updated Sep 25, 2026.