Comparison ledger
Applied Materials 0010-03254 E Chuck, SVG 8800, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03254 E ChuckApplied Materials | 8800SVG |
|---|---|---|
| OEM | Applied Materials | SVG |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | SVG 8800 |
| Cited variants | — | |
| Specifications | ||
| Configuration | — | Dual Coat with soft bake[1] |
| Type | — | Single-track coater and developer[3] |
| Wafer size | — | 6 inch[4] |
| Spindle acceleration | — | Up to 50,000 RPM/second[3] |
| Programmable dispense arm | — | Yes[3] |
| Automatic cassette wafer handling | — | Yes, dual load and unload[3] |
| Edge bead removal | — | Top nozzle[3] |
| Backside rinse | — | Bottom nozzle[3] |
| Hot plate temperature range | — | Up to 300 °C[3] |
| Developer dispense type | — | Pressurized nozzle[3] |
| Developer mode | — | Dynamic or static[3] |
| Developer rinse | — | DI water rinse[3] |
| Coater/Developer type | — | Photoresist coating and developing[3] |
| Spindle Motor Acceleration | — | 50,000 RPM/second[3] |
| Edge Bead Removal | — | Top nozzle for EBR[3] |
| Backside Rinse | — | Bottom nozzle for backside rinse[3] |
| Developer Type | — | Single track with pressurized dispense nozzle[3] |
| Cassette Handling | — | Automatic with dual load and unload[3] |
| Supported Wafer Size | — | 6 inch[4] |
| OEM | — | SVG[4] |
| Model | — | 8800[4] |
| Equipment type | — | Coater / Developer[4] |
| Operating mode | — | Single track dispense photoresist spinner[3] |
| Cassette handling | — | Automatic cassette wafer handling with dual load and unload capability[3] |
| Dispense arm | — | Programmable dispense arm motion[3] |
| EBR | — | Top nozzle for Edge Bead Removal[3] |
| Hot plate oven | — | Programmable up to 300 C[3] |