SUSS MicroTec
XBC300 Gen2
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The SUSS XBC300 Gen2 is a bonding system in the SUSS bonding portfolio. The XBC300 Gen2 performs temporary bonding. The XBC300 Gen2 also performs permanent bonding.[1]
What it is
The SUSS MicroTec XBC300 Gen2 is a bonding system in the semiconductor equipment class. The XBC300 Gen2 belongs to SUSS bonding solutions for temporary bonding, permanent bonding, and hybrid bonding.[1]
How it works
General reference — not yet source-verifiedBonding tools of this class typically align two substrates, bring their surfaces into contact under controlled conditions, and maintain process consistency across the bonded pair. Temporary bonding tools are generally used to support later handling or thinning steps, while permanent bonding tools are generally used to create a final joined structure.
Where it fits in the process flow
General reference — not yet source-verifiedBonding follows earlier preparation steps such as surface conditioning and alignment, and it can precede later operations that depend on mechanical support, device stacking, or final assembly integration. Bonding tools in this class are used to keep process control stable when two prepared surfaces must be joined reliably.
Applications
General reference — not yet source-verifiedBonding equipment is used in semiconductor manufacturing for device stacking, substrate handling during downstream processing, and assembly steps that require controlled joining of two surfaces. Bonding tools are also used where yield and process stability depend on precise contact between prepared substrates.
- Temporary bonding
- Permanent bonding
- Hybrid bonding
What do the numbers mean?
Configuration & options2
Vintage & configurations
What replaced it?
Related models
- siblingSUSS MicroTec SP XB8— Listed alongside the SP XB8 in the Permanent Bonding portfoliosource[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the XBC300 Gen2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the XBC300 Gen2 are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the XBC300 Gen2 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the XBC300 Gen2 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the XBC300 Gen2 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the XBC300 Gen2 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]suss.com — suss.comsuss.com
Last updated Sep 27, 2026.
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