Waferpedia

Tool family

SUSS MicroTec XBC300 Gen2

The SUSS XBC300 Gen2 is a bonding system for temporary, permanent, and hybrid bonding processes.

Models in this family

  1. The SUSS XBC300 Gen2 is a bonding system for temporary, permanent, and hybrid bonding processes.

    Cited variants

    DesignationGenerationVintageChangesSource
    XBC300 Gen2 SPGen2—SP variant listed under Permanent Bondingsuss.com[1]
    XBC300 Gen2 D2WGen2—D2W variant listed under Permanent Bondingsuss.com[1]
    XBC300 Gen2 D2W/W2WGen2—D2W/W2W variant listed under Permanent Bondingsuss.com[1]

Sources

Sources (1)Every fact above is drawn from these public sources
  1. [1]suss.comsuss.com