Waferpedia

Palomar

6532HP

Packaging & BondingPalomar 6532HP family
Research Quality: 60% complete

The Palomar 6532HP is a high-performance die bonder. The Palomar 6532HP is designed for precise and high-volume device assembly in the photonics market. The Palomar 6532HP uses a high-speed die shuttle to transfer components from a presentation station to a bonding station.[1][2][3]

6532HP — web.archive.org
Fig. 016532HPweb.archive.org[1]
  • Plate 01Palomar Technologies 6532HP Die Bonder

    Palomar TechnologiesWatch on YouTube
  • Plate 026532HP Die Bonder

    Palomar TechnologiesWatch on YouTube

What it is

The Palomar 6532HP is a die bonder for precision device assembly.[1][2][3]

The 6532HP is positioned for high-volume die attachment in photonics assembly.[1][2][3]

How it works

The 6532HP combines a high-volume presentation station with a high-precision bonding station.[1][2][3]

The machine transfers components from the presentation station to the bonding station with a high-speed die shuttle.[1][2][3]

Where it fits in the process flow

The 6532HP fits in back-end assembly for photonic and microelectronic device buildout.[1][2][3]

The machine supports die attach processes used for chip on carrier builds, open packages, and finished modules.[1][2][3]

Applications

The 6532HP is used for lasers, photodiodes, capacitors, VCSEL arrays, PD arrays, LD drivers, and TIA devices.[1][2][3]

The machine supports silver sintering, eutectic die bonding, epoxy die bonding, UV die bonding, and solder paste die bonding.[1][2][3]

  • Chip and die
  • Lasers
  • Photo diodes
  • Capacitors
  • VCSEL arrays
  • PD arrays
  • LD drivers
  • Chip on Carrier (CoC, TO, PCB)
  • Single or multiple
  • Multiple die
  • Laser CoC
  • Laser or PD on TC
  • VCSELs/Drivers/Lens on AOC PCB
  • Open Package (GB AA)
  • Laser TOSA/ROSA
  • Receivers
  • Modulators
  • Complex TC AOC
  • Finished Modules
  • Laser Transceiver
  • Receiver TOSA/ROSA
  • Modulator AOC

What do the numbers mean?

Wafer handling3

Component transfer
High-speed die shuttle[1]
Accurate?
Transfer mechanism
High speed die shuttle[1]
Accurate?
Automation option
Automated Handler System[1]
Accurate?

Performance2

Bonding station
High precision[1]
Accurate?
Station architecture
High volume presentation station with a high precision bonding station[1]
Accurate?

Configuration & options13

Machine type
Die bonder[1]
Accurate?
Performance description
High performance[1]
Accurate?
Target market
Photonics market[1]
Accurate?
Presentation station
High volume[1]
Accurate?
Processes
Silver Sintering Die Bonding; Eutectic Die Bonding; Epoxy Die Bonding; UV Die Bonding; Solder Paste Die Bonding[1]
Accurate?
Category
Palomar Die Bonders[1]
Accurate?
Application focus
Photonics market[1]
Accurate?
Vision
VisionPilot® with Vision Standardization[1]
Accurate?
Data system
Bond Data Miner[1]
Accurate?
Heating option
Pulsed Heat Systems[1]
Accurate?
Dispensing option
Dispensing Solutions[1]
Accurate?
UV option
UV Systems[1]
Accurate?
Identification option
Identification Systems[1]
Accurate?
Interested in this tool?
Need help with this tool?Embed spec card

What replaced it?

  • siblingPalomar 3880-II— Listed as a previous model in navigation alongside the 6532HP.source[1]
  • siblingPalomar 6500— Listed as a next model in navigation alongside the 6532HP.source[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Frequently asked questions

What assembly market is the 6532HP aimed at?

The 6532HP is designed for the photonics market.[1][2][3]

What type of transfer mechanism does the 6532HP use?

The 6532HP uses a high-speed die shuttle to move components from the presentation station to the bonding station.[1][2][3]

Which die bonding processes are supported?

The 6532HP supports silver sintering, eutectic die bonding, epoxy die bonding, UV die bonding, and solder paste die bonding.[1][2][3]

Not publicly documented

The following facts about the 6532HP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6532HP are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 6532HP are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 6532HP are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 6532HP are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 6532HP is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]web.archive.org — web.archive.orgweb.archive.org
Was this page accurate?

Last updated Oct 5, 2026.

Compare with similar tools

View all →