Comparison ledger
Branson 101-149-053 Gold Booster, Palomar 6532HP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | 6532HPPalomar |
|---|---|---|
| OEM | Branson | Palomar |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Branson 101-149-053 Gold Booster | Palomar 6532HP |
| Specifications | ||
| Configuration | 1:1.5[1] | — |
| Manufacturer | Branson[2] | — |
| Model | 101-149-053[2] | — |
| Type | Gold Booster[2] | — |
| Operating frequency | 20 kHz[3] | — |
| Gain | 1:1.5[2] | — |
| Mounting thread | 1/2-20[3] | — |
| Length | 5.4 in[3] | — |
| Gain ratio | 1:1.5[2] | — |
| Machine type | — | Die bonder[4] |
| Performance description | — | High performance[4] |
| Target market | — | Photonics market[4] |
| Presentation station | — | High volume[4] |
| Bonding station | — | High precision[4] |
| Component transfer | — | High-speed die shuttle[4] |
| Processes | — | Silver Sintering Die Bonding; Eutectic Die Bonding; Epoxy Die Bonding; UV Die Bonding; Solder Paste Die Bonding[4] |
| Category | — | Palomar Die Bonders[4] |
| Application focus | — | Photonics market[4] |
| Station architecture | — | High volume presentation station with a high precision bonding station[4] |
| Transfer mechanism | — | High speed die shuttle[4] |
| Vision | — | VisionPilot® with Vision Standardization[4] |
| Data system | — | Bond Data Miner[4] |
| Heating option | — | Pulsed Heat Systems[4] |
| Dispensing option | — | Dispensing Solutions[4] |
| Automation option | — | Automated Handler System[4] |
| UV option | — | UV Systems[4] |
| Identification option | — | Identification Systems[4] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →