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Mydata

MY 12

Assembly / SMTMydata MY 12 family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

MY 12 — Inventory photo
Fig. 01MY 12Inventory photo[1]

Power

50/60 Hz[1]

Performance

Repeatability of 15 mm at 3 sigma[4]

What it is

The Mydata MY 12 is an SMT pick-and-place machine used in electronic assembly.[3][4]

The MY 12 belongs to the Mydata MY-series family and is part of a placement system for populating printed circuit boards with components.[5][3]

How it works

General reference — not yet source-verified

A pick-and-place machine removes electronic components from feeders or trays, inspects or centers them with a vision system, and places them onto programmed locations on a board.

Where it fits in the process flow

General reference — not yet source-verified

The MY 12 places components onto printed circuit boards for subsequent thermal attachment in reflow processing.

Applications

The MY 12 is used for surface-mount assembly of printed circuit boards.[3][4]

What do the numbers mean?

Power & electrical3

50/60 Hz[1]
Accurate?
Power / electrical
50/60 Hz[3]
Accurate?
Hydra and Midas heads; conveyorized Z high speed; electrical two pole test; autoteach; electrical transistor test[4]
Accurate?

Performance3

Accuracy
Repeatability of 15 mm at 3 sigma[4]
Accurate?
Rated speed
21,000 CPH IPC 9850 chip net throughput 17,500 CPH[5]
Accurate?
Fine-pitch rated speed
6,100 CPH IPC 9850 fine pitch net throughput 1,500 CPH[5]
Accurate?

Dimensions & facilities2

Machine size
3360 mm length, 1450 mm height, 2000 mm depth, 2134 mm depth, or 2378 mm depth depending on configuration[5]
Accurate?
Weight
2100 kg[5]
Accurate?

Configuration & options8

Type
pick and place machine[3]
Accurate?
Category
Assembly / SMT[3]
Accurate?
Placement rate, standard performance
6,500 CPH[4]
Accurate?
HYDRA Speedmount placement rate on chips
21,000 CPH[4]
Accurate?
Linescan Vision System placement rate on fine-pitch components
6,100 CPH[4]
Accurate?
Feeder capacity
144 x 8 mm tapes or 135 SOIC tubes or 112 x 8 mm tapes and 32 JEDEC trays (with TEX)[4]
Accurate?
Board handling: maximum board size
384 x 508 mm, 563 x 508 mm, 745 x 610 mm, or 932 x 732 mm depending on configuration[5]
Accurate?
Power requirements
Three phase AC 6.6 kVA (3 x 2.2 kVA)[5]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Configuration50/60 Hz[1]
  • Power / electrical50/60 Hz[3]
  • ConfigurationHydra and Midas heads; conveyorized Z high speed; electrical two pole test; autoteach; electrical transistor test[4]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What type of equipment is the MY 12?

The MY 12 is a pick-and-place machine for SMT assembly.[3][4]

Not publicly documented

The following facts about the MY 12 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MY 12 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the MY 12 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the MY 12 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the MY 12 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the MY 12 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]waferpedia.com — waferpedia.comwaferpedia.com
  4. [4]ibesmt.com — ibesmt.comibesmt.com
  5. [5]as-equipment.de — as-equipment.deas-equipment.de
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Last updated Oct 5, 2026.

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