KLA

8720

Research Quality: 50% complete

The KLA Candela 8720 is an optical wafer defect inspection system designed for compound semiconductor wafers up to 200 mm. The Candela 8720 uses continuous-wave 405 nm and 532 nm diode lasers. The Candela 8720 operates in three modes: high-throughput, standard resolution, and high resolution.^[1]^[2]

8720 — Inventory photo — Fig. 018720Inventory photo^[3]

What it is

The KLA 8720, marketed as the Candela 8720, is an advanced surface inspection system designed for the LED, photonics, communications, and other compound semiconductor markets. The system provides automated defect inspection for compound semiconductor wafers.^[2]^[1]

How it works

General reference — not yet source-verified

Optical wafer inspection systems of this class combine multiple detection channels to distinguish morphological anomalies, optical property deviations, and optoelectronic signatures. The multi-channel approach allows the system to decouple scattering contributions from different defect origins.

Applications

General reference — not yet source-verified

Automated defect inspection in compound semiconductor processing helps maintain process control for high-volume manufacturing and enables fast root-cause determination for yield issues.

What do the numbers mean?

Power & electrical1

Electrical Plug^[3]

Accurate?

Wafer handling14

Ring Chuck, 4", 6"^[3]; Robot Arm^[3]; Robot Controller^[3]; Robot Software CD^[3]
Type: Optical Patterned Wafer Defect Inspection System^[1]
Wafer Diameter: 200 mm^[4]2 sources
Substrate: Compound semiconductor wafers^[1]
Defect Detection Capability: Macro-defects ≥5 µm (cracks, slip lines, wafer warpage); micro-defects sub-µm (particles, quantum-well perturbations, localized strain fields)^[1]
Application: Automated defect inspection for LED materials and multiple compound semiconductor substrates^[2]
Macro defect detection: ≥5 µm cracks, slip lines, wafer warpage^[1]
Substrate compatibility: GaN, GaAs, InP, SiC, AlN^[1]
Wafer thickness range: 100 µm to >1 mm^[1]
Wafer handling: Front-end robotic loading with SMIF pod or FOUP compatibility; manual load option^[1]
Defect types detected: Micro-pits, cracks, hexagonal bumps, showerhead droplets, crescents, scratches, slip lines, epi pits, crystal defects, PL scratches, residue, wafer map contour defects^[2]

Optics & imaging4

Laser Wavelengths: 405 nm and 532 nm (continuous-wave diode lasers)^[1]
Operational Modes: High-throughput, standard resolution, high resolution^[2]
Inspection modes: High-throughput, standard resolution, high resolution^[2]
Light sources: Continuous-wave 405 nm and 532 nm diode lasers^[1]

Control & software3

Computer Monitors and Monitor Stands^[3]; Offline Line Software Manual^[3]
Software: KLA Inspector software suite with supervised machine learning defect classification^[1]

Configuration & options16

With:^[3]; Keyboard and Mouse set^[3]; Centering Ring, 4", 6"^[3]; Stage Shaft and Base^[3]; Prealigner^[3]; Electronic Rack^[3]
Data Output: Defect map, Pareto chart, defect inspection summary, contour map, image review with DOI (Defect of Interest)^[2]
Data Format: Vendor-neutral TIFF + XML metadata format^[1]
Data Integrity: Audit-ready metadata tagging per ISO/IEC 17025; timestamped tool parameters, environmental sensor readings (temperature, humidity)^[1]
Detection principle: Multi-angle elastic and inelastic scattering imaging^[1]
Key capabilities: Simultaneous dual-angle scatterometry, surface topography mapping, reflectance profiling, phase contrast imaging, and photoluminescence (PL) detection^[1]
Minimum detectable defect size (micro): Sub-µm particles^[1]
Cleanroom class: Class 100–1000^[1]
Compliance: SEMI E30 (SECS/GEM), ISO 9001^[1]
Data format: Vendor-neutral TIFF + XML metadata^[1]
Optional features: FDA 21 CFR Part 11 compliant electronic signature and audit trail packages^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

ConfigurationElectrical Plug^[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What wafer sizes does the KLA 8720 support?

The system supports wafers up to 200 mm in diameter.^[1]

What are the operating modes of the system?

The system can be operated in high-throughput, standard resolution, and high resolution modes.^[2]

What substrate materials are compatible with the Candela 8720?

The system can inspect GaN, GaAs, InP, SiC, AlN, as well as substrates such as sapphire, silicon, and patterned sapphire (PSS).^[2]^[1]

Does the system support factory automation?

Yes, it meets SEMI E30 (SECS/GEM) communication protocols for factory integration.^[1]

Not publicly documented

The following facts about the 8720 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 8720 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 8720 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 8720 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 8720 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 8720 is not on record.
Answerable by: an OEM datasheet or a fab qualification report