Waferpedia

KLA

2135

Metrology & InspectionKLA 2135 family
Research Quality: 70% complete

The KLA 2135 is a wafer inspection system that uses advanced sensor and image processing technologies to detect yield-relevant defects on all process layers. The KLA 2135 uses KLA's brightfield, small-pixel, high data rate, digital image processing technology for defect detection. The KLA 2135 offers a two- to three-times throughput improvement over the earlier model KLA 2132.[1][2]

2135 — web.archive.org
Fig. 012135web.archive.org[1]

Power

3-phase 480V[3]

Performance

two to three times[1]

Optics

193nm DUV laser[3]

Preceded by
2132
This tool
2135
Succeeded by
Latest generation
All related

What it is

The KLA 2135 is a wafer inspection system used in semiconductor manufacturing. The KLA 2135 incorporates advanced sensor and image processing technologies. The KLA 2135 detects yield-relevant defects on all process layers with high capture rates, automatically and consistently. The KLA 2135 offers a two- to three-times throughput improvement over the earlier model KLA 2132. The KLA 2135 belongs to the KLA 2135 family of metrology and inspection equipment.[1][4][2]

How it works

The KLA 2135 uses brightfield, small-pixel, high data rate, digital image processing technology. The KLA 2135 provides complete visual access to all defect types for yield correlation. The KLA 2135 detects the widest range of yield-relevant defects at all process layers.[1][2]

Where it fits in the process flow

The KLA 2135 is configured for in-line monitoring of advanced processes. The KLA 2135 detects handling, tooling, and process defects across all process layers. The KLA 2135 operates at the speeds required for high-volume wafer production.[1]

Applications

The KLA 2135 is used for detection of all types of yield-relevant defects on every process layer. The KLA 2135 supports complete yield correlation and yield strategy implementation. The KLA 2135 is suited to in-line monitoring of advanced processes.[1]

  • in-line monitoring of advanced processes
  • detecting yield-relevant defects on all process layers

What do the numbers mean?

Power & electrical2

Power supply input
3-phase 480V[3]
Accurate?
Power supply output
12V DC[3]
Accurate?

Wafer handling1

Product type
wafer inspection system[1]
Accurate?

Optics & imaging3

Laser type
193nm DUV laser[3]
Accurate?
Laser output power
200W[3]
Accurate?
Objective NA
0.95[3]
Accurate?

Performance2

Throughput
two- to three-times throughput improvement over the earlier model KLA 2132[1]
Accurate?
Throughput improvement over KLA 2132
two to three times[1]
Accurate?

Configuration & options7

Technology
advanced sensor and image processing technologies[1]
Accurate?
Inspection method
brightfield, small-pixel, high data rate, digital image processing technology[1]
Accurate?
Defect detection
detects all types of yield-relevant defects on all process layers[1]
Accurate?
Operational use
in-line monitoring of advanced processes[1]
Accurate?
Inspection technology
brightfield, small-pixel, high data rate, digital image processing technology[1]
Accurate?
Scan speed
120 mm/sec[3]
Accurate?
Target process node
90nm–28nm[3]
Accurate?

Vintage & configurations

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What replaced it?

  • predecessorKLA 2132— described as the earlier model, with the 2135 offering two- to three-times throughput improvementsource[1]

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Power supply input3-phase 480V[3]
  • Power supply output12V DC[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the KLA 2135?

The KLA 2135 is a wafer inspection system that uses advanced sensor and image processing technologies to detect yield-relevant defects on all process layers.[1][4]

How does the throughput of the KLA 2135 compare with the earlier model KLA 2132?

The KLA 2135 offers a two- to three-times throughput improvement over the earlier model KLA 2132.[1]

What inspection method does the KLA 2135 use?

The KLA 2135 uses brightfield, small-pixel, high data rate, digital image processing technology.[1]

What defect types can the KLA 2135 detect?

The KLA 2135 can detect all types of yield-relevant defects, covering handling, tooling, and process defects, at all process layers.[1]

What process nodes is the KLA 2135 targeted at?

The KLA 2135 targets semiconductor process nodes from 90 nm down to 28 nm.[3]

Not publicly documented

The following facts about the 2135 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2135 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 2135 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 2135 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 2135 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 2135 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]KLA 2135 vs KLA 2350 | Waferpedia — waferpedia.comwaferpedia.com
  3. [3]caladansemi.com — caladansemi.comcaladansemi.com
  4. [4]KLA 2135 family | Waferpedia — waferpedia.comwaferpedia.com
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Last updated Sep 25, 2026.

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