F&K Delvotec
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The F&K Delvotec G 5 is a wire bonder used in semiconductor packaging and bonding. The G 5 62000 configuration runs with 25 µm wire and features a ball/wedge bondhead. The G 5 62000 has a 120 kHz transducer and supports 90-degree bonding. The machine is vacuum based and operates on 100-120 / 200-240 V with 0.6 kVA power consumption.[5][4]
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The following facts about the G 5 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the G 5 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the G 5 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the G 5 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the G 5 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the G 5 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 10, 2026.
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