Waferpedia

Comparison ledger

G 5versus10490

F&K Delvotec G 5, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
G 5F&K Delvotec
10490West Bond
OEMF&K DelvotecWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyF&K Delvotec G 5West Bond 10490
Specifications
Configuration45° or 90° Bondhead[1]—
Equipment typeWire bonder[1]—
Bondhead45° or 90° bondhead[1]—
ConditionRefurbished[1]—
Vintage2014[1]—
Wire diameter25 µm wire[2]—
Bondhead typeBall/wedge bondhead[2]—
Power100-120 / 200-240 V, 0.6 kVA[2]—
Phase50/60 Hz, Phase 5, 2.5 A[2]—
Transducer120 kHz[2]—
VacuumVacuum based[2]—
Minimum pad sizePCB 70 µm minimum pad size[2]—
Angle90 degrees[2]—
Manufacturer—West Bond[3]
Model—10490[3]
Description—Convertible bonder, wedge to ball[4]
Tool type—Convertible bonder[5]
Bonding modes—Wedge bonding and ball bonding[5]
Use—Wire bonding[5]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]Equipment inventory listing
  4. [4]fabsurplus.comfabsurplus.com
  5. [5]waferpedia.comwaferpedia.com