EV Group
850
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The EVG 850 is a wafer bonding system from EV Group that supports wafer sizes of 2, 3, 4, 5, 6, 8, and 12 inches. The EVG 850 LT is an automated production bonding system for SOI and direct wafer bonding with LowTemp plasma activation. The EVG 850 TB is a fully automated temporary bonding system for bonding a device wafer to a carrier wafer.[1][2]
What it is
General reference — not yet source-verifiedThe EV Group 850 is a wafer bonding system used in semiconductor manufacturing.
How it works
The EVG 850 LT combines cleaning, plasma activation, pre-bonding, and infrared inspection in one automated production bonding system for SOI and direct wafer bonding.[1]
The EVG 850 LT uses mechanically aligned bonding with flat-to-flat or notch-to-notch alignment, and it includes a LowTemp plasma activation module.[1]
Where it fits in the process flow
Applications
The EVG 850 TB is intended for temporary wafer bonding on a rigid carrier, and it supports different substrate and carrier combinations including silicon, glass, and sapphire carriers.[2]
What do the numbers mean?
Vacuum & pumping1
Wafer handling6
Gas & chemistry2
- Additional process gases (LT)
- High purity gases (99.999%), noble gases (Ar, He, Ne, etc.), forming gases (N2, Ar with up to 4 % H2)[1]
Performance2
Configuration & options4
- Cleaning methods (LT)
- Rinse standard; megasonic nozzle, megasonic area transducer, jet nozzle, brush optional[1]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| EVG 850 LT | — | — | Automated production bonding system for SOI and direct wafer bonding with LowTemp plasma activation | evgroup.com[1] |
| EVG 850 TB | — | — | Fully automated temporary bonding system for temporary adhesive application, baking, alignment and bonding of device wafer to carrier wafer | evgroup.com[2] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What alignment accuracy is specified for the EVG 850 LT?
The EVG 850 LT specifies X and Y alignment accuracy of ± 50 µm and theta alignment accuracy of ± 0.1 degree.[1]
What process steps are integrated in the EVG 850 LT?
The EVG 850 LT combines cleaning, plasma activation, pre-bonding, and IR inspection in one system.[1]
What temporary bonding features are specified for the EVG 850 TB?
The EVG 850 TB has an open adhesive platform, supports multiple carriers, offers recipe control, records process parameters in real time, and includes a fully integrated SECS/GEM interface.[2]
What substrate size does the EVG 850 TB support?
The EVG 850 TB supports wafer diameters up to 300 mm and can use an oversized carrier.[2]
Not publicly documented
The following facts about the 850 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 850 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 850 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 850 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 850 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 850 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]evgroup.com — evgroup.comevgroup.com
- [2]evgroup.com — evgroup.comevgroup.com
- [3]Equipment inventory listing
Last updated Sep 27, 2026.
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