Dektak
Provisional entry — research in progress
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Power
100-120 VAC / 200-240 VAC, 50-60 Hz[1]
Performance
7.5 Å, 1 sigma on 1 μm step[1]
Optics
1 Å max (@ 6.55 μm range)[1]
The Dektak 8 is a contact profilometer used for surface topography measurement. The instrument characterizes film thickness, roughness, stress, and defects on samples up to 200 mm (8 inches).[2][3][1]
The Dektak 8 is a stylus profilometer that measures two-dimensional and three-dimensional surface profiles. The instrument delivers step height repeatability of 7.5 angstroms (1 sigma) and a vertical resolution of 1 angstrom at the 6.55 micrometer range.[3][1]
Stylus profilometers measure surface topography by dragging a sharp stylus across the sample while a sensor records vertical deflections. The Dektak 8 uses a Low-Inertia Sensor (LIS 3) with a stylus force of 1 to 15 mg.[1]
An optional N-Lite low-force sensor provides dynamic stylus forces down to 0.03 mg. The N-Lite sensor enables the use of super-sharp 50 nm radius styli and high-aspect-ratio tips for measuring deep trenches and soft materials. The instrument uses a programmable 200 mm X/Y sample stage with manual rotation and leveling as standard.[1]
The Dektak 8 features dual magnification objectives (70X and 280X) for sample viewing. The system includes a 3-point suspension and guide pins for repeatable wafer positioning. Measurements are referenced to an optical flat for a stable baseline.[1]
The Dektak 8 is used in semiconductor and thin-film process flows as a metrology tool for post-deposition and post-etch characterization. The instrument measures step height, film thickness, roughness, and stress on wafers up to 200 mm in diameter.[3][1]
The profilometer can accommodate samples with a maximum thickness of 25.4 mm. Scan lengths of up to 50 mm (standard) or 100 mm (optional) allow planarity and stress measurement across large areas.[3][1]
The Dektak 8 is used for MEMS characterization, thin- and thick-film coating measurement, thin-film stress calculations, and roughness measurement on wafers and machined parts. The instrument also measures transparent films, photoresist thickness, metal etch uniformity, and compound semiconductor devices on GaAs wafers.[1]
Additional applications include microlens height and curvature measurement, V-groove depth characterization, and surface quality and defect review. The instrument provides 3D surface characterization with over 200 analysis tools in the optional Vision32 software.[1]
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The standard vertical range is 262 micrometers; an optional 1 millimeter range is available.[3][1]
The step height repeatability is 7.5 angstroms (1 sigma) on a 1 micrometer step.[3][1]
The Dektak 8 can accommodate samples up to 200 mm (8 inches).[3][1]
The Dektak 8 achieves a vertical resolution of 1 angstrom at the 6.55 micrometer range.[3][1]
Standard scan length is 50 mm; an optional 100 mm scan length is available.[1]
The following facts about the 8 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 8 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 8 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 8 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 8 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 8 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 1, 2026.
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KLA .496 PSL Wafer is an 8-inch NIST traceable wafer stated to be capable on Surfscan 6xy0 and SP1.
The KLA .498 PSL Wafer is a NIST traceable reference wafer.