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Dektak

8

Metrology & InspectionDektak 8 family
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Dektak8
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Power

100-120 VAC / 200-240 VAC, 50-60 Hz[1]

Performance

7.5 Å, 1 sigma on 1 μm step[1]

Optics

1 Å max (@ 6.55 μm range)[1]

What it is

The Dektak 8 is a contact profilometer used for surface topography measurement. The instrument characterizes film thickness, roughness, stress, and defects on samples up to 200 mm (8 inches).[2][3][1]

The Dektak 8 is a stylus profilometer that measures two-dimensional and three-dimensional surface profiles. The instrument delivers step height repeatability of 7.5 angstroms (1 sigma) and a vertical resolution of 1 angstrom at the 6.55 micrometer range.[3][1]

How it works

Stylus profilometers measure surface topography by dragging a sharp stylus across the sample while a sensor records vertical deflections. The Dektak 8 uses a Low-Inertia Sensor (LIS 3) with a stylus force of 1 to 15 mg.[1]

An optional N-Lite low-force sensor provides dynamic stylus forces down to 0.03 mg. The N-Lite sensor enables the use of super-sharp 50 nm radius styli and high-aspect-ratio tips for measuring deep trenches and soft materials. The instrument uses a programmable 200 mm X/Y sample stage with manual rotation and leveling as standard.[1]

The Dektak 8 features dual magnification objectives (70X and 280X) for sample viewing. The system includes a 3-point suspension and guide pins for repeatable wafer positioning. Measurements are referenced to an optical flat for a stable baseline.[1]

Where it fits in the process flow

The Dektak 8 is used in semiconductor and thin-film process flows as a metrology tool for post-deposition and post-etch characterization. The instrument measures step height, film thickness, roughness, and stress on wafers up to 200 mm in diameter.[3][1]

The profilometer can accommodate samples with a maximum thickness of 25.4 mm. Scan lengths of up to 50 mm (standard) or 100 mm (optional) allow planarity and stress measurement across large areas.[3][1]

Applications

The Dektak 8 is used for MEMS characterization, thin- and thick-film coating measurement, thin-film stress calculations, and roughness measurement on wafers and machined parts. The instrument also measures transparent films, photoresist thickness, metal etch uniformity, and compound semiconductor devices on GaAs wafers.[1]

Additional applications include microlens height and curvature measurement, V-groove depth characterization, and surface quality and defect review. The instrument provides 3D surface characterization with over 200 analysis tools in the optional Vision32 software.[1]

What do the numbers mean?

Power & electrical1

Input Voltage
100-120 VAC / 200-240 VAC, 50-60 Hz[1]
Accurate?

Wafer handling1

Max Wafer Size
200 mm (8 in.)[1]
Accurate?

Optics & imaging2

Vertical Resolution
1 Å max (@ 6.55 μm range)[1]
Accurate?
Stylus Options
Stylus radius options from 0.2 to 25 μm; Super Sharp 50 nm stylus for use with N-Lite; High Aspect Ratio (HAR) tips for 10 μm D x 2 μm W trenches or 200 μm D x 20 μm W trenches[1]
Accurate?

Performance1

Step Height Repeatability
7.5 Å, 1 sigma on 1 μm step[1]
Accurate?

Dimensions & facilities2

Dimensions (W x D x H)
457 mm x 610 mm x 483 mm (18 in. x 24 in. x 19 in.)[1]
Accurate?
Weight
48 kg (105 lbs)[1]
Accurate?

Configuration & options7

Measurement Technique
Stylus profilometry[1]
Accurate?
Scan Length Range
50 mm (2 in.) standard; 100 mm (4 in.) optional[1]
Accurate?
Vertical Range
262 μm standard; 1 mm optional[1]
Accurate?
Max Sample Thickness
25.4 mm (1 in.)[1]
Accurate?
Stylus Force
1 to 15 mg with standard LIS 3; 0.03 to 15 mg with N-Lite sensor option[1]
Accurate?
Temperature Range
15 to 30 °C (59 to 86 °F)[1]
Accurate?
Humidity Range
≤ 80%, non-condensing[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Input Voltage100-120 VAC / 200-240 VAC, 50-60 Hz[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What is the maximum vertical range of the Dektak 8?

The standard vertical range is 262 micrometers; an optional 1 millimeter range is available.[3][1]

What is the step height repeatability of the Dektak 8?

The step height repeatability is 7.5 angstroms (1 sigma) on a 1 micrometer step.[3][1]

What is the maximum wafer size the Dektak 8 can handle?

The Dektak 8 can accommodate samples up to 200 mm (8 inches).[3][1]

What vertical resolution does the Dektak 8 achieve?

The Dektak 8 achieves a vertical resolution of 1 angstrom at the 6.55 micrometer range.[3][1]

What scan lengths are available on the Dektak 8?

Standard scan length is 50 mm; an optional 100 mm scan length is available.[1]

Not publicly documented

The following facts about the 8 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 8 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 8 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 8 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 8 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 8 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]img.antpedia.com — img.antpedia.comimg.antpedia.com
  2. [2]Equipment inventory listing
  3. [3]Veeco Dektak 8 Profilometer – UCLA Nanolab — nanolab.ucla.edunanolab.ucla.edu
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Last updated Oct 1, 2026.

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