ASM
AD 838 L
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ASM AD 838 L is a die bonder used in semiconductor packaging. The ASM AD 838 L G 2 variant supports 6-inch and 8-inch wafers.[1]
Wafer size
Wafer Loader
Power
50/60 Hz[2]
What it is
General reference — not yet source-verifiedDie bonders are machines that attach semiconductor die to substrates or leadframes using adhesives, solder, or other bonding materials. The ASM AD 838 L is a die bonder manufactured by ASM for use in semiconductor packaging operations.
How it works
General reference — not yet source-verifiedA die bonder picks individual semiconductor die from a wafer or tape-and-reel and places them onto a substrate or package. The machine dispenses a controlled amount of adhesive or solder paste onto the bonding site before placing the die. After placement, the die is pressed into the bond line with a defined force, and the assembly may be heated or cured to solidify the bond.
Where it fits in the process flow
General reference — not yet source-verifiedDie bonding occurs after wafer dicing, where individual die are singulated from the wafer. The die bonder places the die onto a substrate or leadframe, which then proceeds to wire bonding, encapsulation, and final test. The AD 838 L is used in the die-attach step of the packaging process flow.
Applications
General reference — not yet source-verifiedDie bonders are used in the assembly of a wide range of semiconductor packages, including ball grid arrays (BGA), quad flat packages (QFP), and system-in-package (SiP) modules. The machines handle die for memory, logic, analog, and power devices.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- The input elevator is missing the pushing device to feed workpieces from a cassette automatically.
- The input workpiece push arm is missing from the left hand side of the tool.
- One of the two archerfish dispensing modules does not work.
- The gripper needs to be leveled.
What do the numbers mean?
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| AD 838 L G 2 | — | 2020 | Listed as a die bonder for 6-inch and 8-inch wafers; one of the two archerfish dispensing modules does not work; gripper needs to be leveled. | Equipment inventory listing[1] |
| ASM AD 838 L G 2 | — | 2020 | Supports 6-inch and 8-inch wafers; includes two archerfish dispensing modules. | Equipment inventory listing[1] |
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Finetech Lambda— Same function class: Packaging & Bonding, UnknownCompare in depthsource[2]
- MRSI HVM3— Same function class: Packaging & Bonding, UnknownCompare in depthsource[2]
- Kulicke & Soffa IBond 5000— Same function class: Packaging & Bonding, UnknownCompare in depthsource[2]
- Hybond 572 A 40 Thermosonic Wire & Ribbon— Same function class: Packaging & Bonding, UnknownCompare in depthsource[2]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the AD 838 L are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AD 838 L are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the AD 838 L are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the AD 838 L is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the AD 838 L are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the AD 838 L are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Sources & citations
Sources (17)Every fact above is drawn from these public sources
- [1]Equipment inventory listing — Equipment inventory listing
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]Inventory photo
- [8]Inventory photo
- [9]Inventory photo
- [10]Inventory photo
- [11]Inventory photo
- [12]Inventory photo
- [13]Inventory photo
- [14]Inventory photo
- [15]inventory listing
- [16]Equipment inventory listing — Equipment inventory listing
- [17]ASM AD 838 L Die Bonder – Bridge Tronic Global — Equipment inventory listing
Last updated Oct 9, 2026.
Compare with similar tools
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The Hybond 572 A 40 is a thermosonic wire and ribbon bonder with long-reach bonding, wire and ribbon capability, and a 6 x 8.5 inch work platform.
MRSI-HVM3 is a high-precision die bonding platform for high-volume production, described by MRSI as a 3-micron class system.
The Kulicke & Soffa IBond 5000 is a wire bonder with ball-wedge bonding capability.
Finetech Lambda is a die bonder with sub-micron placement accuracy, supporting thermocompression and ultrasonic bonding.
