Waferpedia

Comparison ledger

0010-47763 ASSY ESC Bonded Monopolar Dual HeatedversusAD 838 L

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, ASM AD 838 L, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsASM
CategoryPackaging & BondingPackaging & Bonding
Wafer size—Wafer Loader
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedASM AD 838
Cited variants—
  • AD 838 L G 2[1]
  • ASM AD 838 L G 2[1]
Specifications
ConfigurationRefurbished[2]50/60 Hz[3]
Voltage—230 Vac[3]
Phase—1 Phase[3]
Power Consumption—1300 w[5]
Wafer size—Wafer Loader[6]
Power—1300 w[7]
Frequency—50/60 Hz[8]
Wafer Sizes—6 inch, 8 inch[1]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (8)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]inventory listing
  7. [7]inventory listing
  8. [8]Equipment inventory listing