Mattson Aspen

Models in this family

1. 

   Aspenproduced 1990–

   The Mattson Aspen is a family of plasma processing systems for strip, etch, and deposition, including the Aspen II and Aspen III platforms.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Aspen II	—	1990	Based on highly reliable and productive system design; ICP source with grounded Faraday shield; dual wafer chamber design; wafer sizes 100, 150, 200 mm	mattson.com[1]
   Aspen II Strip	—	—	Strip system using Aspen II platform, with one or two processing chambers, dual wafer processing	semiconductoronline.com[2]
   Aspen II Silicon Soft Etch (SSE)	—	—	Isotropic etch with high percentage fluorine chemistry	mattson.com[1]
   Aspen III	—	—	Based on proprietary ICP source with grounded Faraday shield; handles 200 mm and 300 mm wafers; supports warped and translucent wafers; dual wafer chamber design	mattson.com[1]
   Aspen III Strip	—	—	Strip system using Aspen III platform, with one, two, or three processing chambers; dual wafer processing	semiconductoronline.com[2]
   Aspen III CVD	—	—	CVD system for dielectric and silane-based films, PECVD, handles 200mm and 300mm	semiconductoronline.com[3]

2. 

   Aspen II

   The Mattson Aspen II Asher is a semiconductor ashing tool offered by Mattson, with configurations supporting 6-inch and 8-inch wafer sizes.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Aspen II (6 inch)	—	—	Supports 6-inch wafers only.	Equipment inventory listing[4]
   Aspen II (6/8 inch)	—	—	Supports both 6-inch and 8-inch wafers.	Equipment inventory listing[5]
   Aspen II (no size specified)	—	—	No wafer size specified in source.	Equipment inventory listing[6]
   Aspen II (1994 vintage)	—	1994–1994	Vintage variant from 1994, 6-inch wafer size.	Equipment inventory listing[7]
   Aspen II (1996 vintage)	—	1996–1996	Vintage variant from 1996, 6-inch wafer size.	Equipment inventory listing[8]

3. Aspen III

   The Mattson Aspen III is a plasma processing platform offered in asher and plasma-enhanced chemical vapor deposition configurations, with variants supporting 200mm and 300mm wafers.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Aspen III Highlands	—	—	Advanced 200/300mm system for low-k cleaning and high-dose implant resist removal; proprietary ICP technology; dual-wafer processing; modular design allowing added process modules	web.archive.org[9]
   Aspen III CVD	—	1999	Plasma enhanced chemical vapor deposition; 200/300mm bridge tool using same chamber for both wafer sizes; up to 180 wafers per hour; deposits silane-based and TEOS-based films	web.archive.org[10]

Sources