Comparison ledger
KLA 0035235-003 MMD Head, KLA 2135, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2135KLA | |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 0035235-003 MMD Head | KLA 2135 |
| Specifications | ||
| Configuration | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Model | 0035235-003[1] | — |
| Make | KLA[1] | — |
| Part Description | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Compatible System | KLA AIT-XP[1] | — |
| Product type | — | wafer inspection system[2] |
| Technology | — | advanced sensor and image processing technologies[2] |
| Inspection method | — | brightfield, small-pixel, high data rate, digital image processing technology[2] |
| Defect detection | — | detects all types of yield-relevant defects on all process layers[2] |
| Operational use | — | in-line monitoring of advanced processes[2] |
| Throughput | — | two- to three-times throughput improvement over the earlier model KLA 2132[2] |
| Inspection technology | — | brightfield, small-pixel, high data rate, digital image processing technology[2] |
| Throughput improvement over KLA 2132 | — | two to three times[2] |
| Laser type | — | 193nm DUV laser[3] |
| Laser output power | — | 200W[3] |
| Objective NA | — | 0.95[3] |
| Scan speed | — | 120 mm/sec[3] |
| Power supply input | — | 3-phase 480V[3] |
| Power supply output | — | 12V DC[3] |
| Target process node | — | 90nm–28nm[3] |
Plan your fab
Building a Metrology & Inspection process? Get a complete equipment list.
Open the fab equipment planner →