Waferpedia

Comparison ledger

DFD 6340 Automatic DicingversusADS 800 Dicing

Disco DFD 6340 Automatic Dicing, Veeco ADS 800 Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Dicing & Grinding, null[1]
Side-by-side comparison of selected equipment models
Attribute
OEMDiscoVeeco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFD 6340Veeco ADS 800 Dicing
Specifications
ConfigurationMissing ZI motor[1]50/60 Hz[6]
Phase3 Phase[2]3 Phase[6]
Voltage220 Vac[2]220 VAC[6]
MakeDisco[1]—
ModelDFD 6340[1]—
Machine typeAutomatic dicing saw[1]—
Wafer size8 inch[4]—
Electrical configuration3 Phase, 3 Wire + Ground, 220 Vac, 50/60 Hz[2]—
Example unit vintage2013[1]—
Power requirement—220 VAC, 3-phase, 50/60 Hz, 30 Amp[6]
Components—motion, control, vision, and coolant delivery components[7]
Workpiece size—up to 8 inch[8]
Spindle—high-performance air bearing spindle[8]
Motion structure—single-piece bridge cast iron structure[8]
Blade capability—multi-blade capabilities[8]
HMI software—Veeco HMI Software[8]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (8)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]Equipment inventory listing
  5. [5]Equipment inventory listing
  6. [6]inventory listing
  7. [7]waferpedia.comwaferpedia.com
  8. [8]schmidt.com.twschmidt.com.tw