Disco
DFD 6340 Automatic Dicing
The Disco DFD 6340 is an automatic dicing saw for semiconductor wafers. The Disco DFD 6340 supports 8-inch wafer sizes. The Disco DFD 6340 operates on 3-phase, 200–220 VAC, 50/60 Hz power.[1][2][3]
What it is
How it works
General reference — not yet source-verifiedAutomatic dicing saws cut wafers with a high-speed spindle carrying a thin diamond-impregnated blade. The wafer is held on a vacuum chuck and moved beneath the blade to follow the streets between die. A precision pattern-recognition system aligns the wafer to the dicing streets. Water spray cools the cut and flushes debris from the blade.
Automatic operation follows programmed cut paths and advances the wafer between cuts without manual positioning.
Where it fits in the process flow
General reference — not yet source-verifiedWafer dicing is performed after front-end processing and wafer thinning. The wafer is mounted on dicing tape stretched over a frame before cutting. After dicing, the singulated die are picked from the tape for die attach and packaging.
Automatic dicing saws sit downstream of wafer thinning and upstream of die attach in the assembly flow.
Applications
General reference — not yet source-verifiedDicing saws cut semiconductor wafers into individual device die. The same class of saw handles silicon, compound semiconductors, glass, and ceramic substrates. Applications include integrated circuits, discrete devices, and other wafer-fabricated components.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Missing ZI motor
- No elevator
What do the numbers mean?
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Veeco ADS 800 Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[4]
- Accretech AD 3000 T Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[4]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DFD 6340 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFD 6340 Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFD 6340 Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFD 6340 Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the DFD 6340 Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the DFD 6340 Automatic Dicing are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (10)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]Inventory photo
- [8]Inventory photo
- [9]Inventory photo
- [10]Equipment inventory listing
Last updated Sep 29, 2026.
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The Accretech AD 3000 T Dicing is a fully automatic dicing saw for 300 mm wafers.
The Veeco ADS 800 Dicing System is a dicing system configured with a 220 VAC, 3-phase, 50/60 Hz, 30 Amp power requirement and includes motion, control, vision, and coolant delivery components.
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
General referenceThe Blanchard 18 D Surface is a vertical-spindle rotary-table surface grinding machine used to produce flat, parallel surfaces on metal workpieces.
