Comparison ledger
Disco DCS 1440 Wafer Cleaner Spin, Disco DCS 1460 Wafer Cleaner Spin, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ||
|---|---|---|
| OEM | Disco | Disco |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DCS | Disco DCS |
| Specifications | ||
| Configuration | 5 in. table[1] | Table upgrade for VCSEL cleaning[3] |
| Max. workpiece size | Φ8 inch[2] | Φ300 mm[4] |
| Table RPM | 100 - 3000 min^-1[2] | 100 to 3,000 min^-1[4] |
| Setting time for cleaning/drying | 0 - 999 sec[2] | 0 to 999 sec[4] |
| Cleaning nozzle speed | 1 - 37.5 °/sec[2] | 1 to 37.5 °/sec[4] |
| Cleaning range | Φ365 mm (up to 210 x 210 mm)[2] | Φ450 mm (up to 310 x 310 mm)[4] |
| Cleaning pressure range | 2.3 - 11.8 MPa[2] | 2.3 to 11.8 MPa[4] |
| Equipment dimensions (W×D×H) | 400 × 600 × 1220 mm[2] | 500 × 650 × 1,220 mm[4] |
| Dry mass | Approx. 124 kg[2] | — |
| Voltage | 200-240 VAC[1] | — |
| Frequency | 50/60 Hz[1] | — |
| Table size | 5 in.[1] | — |
| Arm configuration | Double arm[1] | — |
| Wiring | 3 Wire + ground[1] | — |
| Maximum workpiece size | — | Φ300 mm[4] |
| Application frame | — | 2-12[4] |
| Table RPM range | — | 100 to 3,000 min⁻¹[4] |
| Equipment weight (Dry mass) | — | Approx. 144 kg[4] |
| Cleaning nozzles | — | Standard high pressure cleaning nozzle; optional atomizing cleaning nozzle; dual nozzle configuration possible[4] |
| Operator interface | — | 4 inch LCD touch panel[4] |
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