Waferpedia

Disco

DCS 1440 Wafer Cleaner Spin

Wet Processing / CleanDisco DCS family
Research Quality: 50% complete

The Disco DCS 1440 is an automatic cleaning system for cleaning workpieces that have been cut on a dicing saw. The DCS 1440 supports 3- to 8-inch tape and frame workpieces.[1]

DCS 1440 Wafer Cleaner Spin — Inventory photo
Fig. 01DCS 1440 Wafer Cleaner SpinInventory photo[2]

Power

50/60 Hz[2]

Vacuum

2.3 - 11.8 MPa[1]

What it is

The Disco DCS 1440 is an automatic cleaning system for wafer and workpiece cleaning after dicing saw processing.[1]

The DCS 1440 is a wafer cleaner and spin dryer in DISCO's accessory equipment line.[2][1]

The DCS 1440 supports workpieces up to 8-inch wafers and tape-and-frame formats.[1]

How it works

The DCS 1440 cleans workpieces with a rotary table and cleaning nozzles.[1]

The DCS 1440 allows the cleaning arm sweep speed and cleaning locations to be configured for each cleaning sequence.[1]

The DCS 1440 can use a standard high-pressure cleaning nozzle or an atomizing cleaning nozzle, and the two nozzle types can be mounted in a double-arm configuration.[1]

The DCS 1440 uses a touch-panel interface for operation and cleaning sequence setup.[1]

Where it fits in the process flow

The DCS 1440 sits after dicing saw processing and removes residue from cut workpieces.[1]

Applications

The DCS 1440 is used to clean workpieces cut on a dicing saw.[1]

The DCS 1440 supports semiconductor workpieces in wafer formats and tape-and-frame formats, and it also supports square workpieces as an option.[1]

What do the numbers mean?

Power & electrical3

50/60 Hz[2]
Accurate?
Voltage
200-240 VAC[2]
Accurate?
Frequency
50/60 Hz[2]
Accurate?

Vacuum & pumping1

Cleaning pressure range
2.3 - 11.8 MPa[1]
Accurate?

Dimensions & facilities2

Equipment dimensions (W×D×H)
400 × 600 × 1220 mm[1]
Accurate?
Dry mass
Approx. 124 kg[1]
Accurate?

Configuration & options12

5 in. table[2]
Accurate?
Double arm[2]
Accurate?
200-240 VAC[2]
Accurate?
3 Wire + ground[2]
Accurate?
Max. workpiece size
Φ8 inch[1]
Accurate?
Table RPM
100 - 3000 min^-1[1]
Accurate?
Setting time for cleaning/drying
0 - 999 sec[1]
Accurate?
Cleaning nozzle speed
1 - 37.5 °/sec[1]
Accurate?
Cleaning range
Φ365 mm (up to 210 x 210 mm)[1]
Accurate?
Table size
5 in.[2]
Accurate?
Arm configuration
Double arm[2]
Accurate?
Wiring
3 Wire + ground[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Configuration50/60 Hz[2]
  • Cleaning pressure range2.3 - 11.8 MPa[1]
  • Voltage200-240 VAC[2]
  • Frequency50/60 Hz[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What kind of equipment is the DCS 1440?

The DCS 1440 is an automatic cleaning system for cut workpieces.[1]

What process does the DCS 1440 follow?

The DCS 1440 is used to clean workpieces that have been cut on a dicing saw.[1]

What workpiece formats does the DCS 1440 support?

The DCS 1440 supports 3- to 8-inch tape-and-frame workpieces.[1]

Does the DCS 1440 support square workpieces?

The DCS 1440 supports square workpieces up to 250 by 250 mm as an option.[1]

What nozzle options are available on the DCS 1440?

The DCS 1440 can use a standard high-pressure cleaning nozzle or an atomizing cleaning nozzle.[1]

Not publicly documented

The following facts about the DCS 1440 Wafer Cleaner Spin are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DCS 1440 Wafer Cleaner Spin are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the DCS 1440 Wafer Cleaner Spin are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the DCS 1440 Wafer Cleaner Spin are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DCS 1440 Wafer Cleaner Spin are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the DCS 1440 Wafer Cleaner Spin is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (6)Every fact above is drawn from these public sources
  1. [1]disco.co.jp — disco.co.jpdisco.co.jp
  2. [2]Inventory photo
  3. [3]Inventory photo
  4. [4]Inventory photo
  5. [5]Inventory photo
  6. [6]Inventory photo
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Last updated Oct 9, 2026.

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