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Comparison ledger

DAG 810 AutomaticversusADS 800 Dicing

Disco DAG 810 Automatic, Veeco ADS 800 Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Dicing & Grinding, Unknown[1]
Side-by-side comparison of selected equipment models
Attribute
OEMDiscoVeeco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DAG 810Veeco ADS 800 Dicing
Cited variants
  • DAG 810 with Taiko Option[2]
—
Specifications
ConfigurationTaiko Option[2]50/60 Hz[4]
Voltage100 V[2]220 VAC[4]
Phase3 Phase[2]3 Phase[4]
Full Load Current10 A[2]—
Largest Load3 A[2]—
Interrupting Capacity14 kA[2]—
Spindle rated power4.2 kW[3]—
Rated torque5.9 N·m[3]—
Speed range1,000 to 7,000 min⁻¹[3]—
Wafer Sizes8 inch[3]—
Vintage2016[3]—
Frequency50/60 Hz[2]—
Wiring3 Wire + Ground[3]—
Control SystemOriginal control system and safety guard, touchscreen interface[3]—
OEMDisco[1]—
ModelDAG 810[1]—
Machine typeAutomatic Grinder[1]—
OptionTaiko Option[2]—
Power supply100 V, 3 phase, 50/60 Hz[2]—
Control systemOriginal control system[3]—
Safety guardOriginal safety guard[3]—
InterfaceTouchscreen interface[3]—
Power requirement—220 VAC, 3-phase, 50/60 Hz, 30 Amp[4]
Components—motion, control, vision, and coolant delivery components[5]
Workpiece size—up to 8 inch[6]
Spindle—high-performance air bearing spindle[6]
Motion structure—single-piece bridge cast iron structure[6]
Blade capability—multi-blade capabilities[6]
HMI software—Veeco HMI Software[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com
  6. [6]schmidt.com.twschmidt.com.tw