Disco
The Disco DAG 810 Automatic Grinder is a semiconductor wafer grinding tool for 8-inch wafers. The Disco DAG 810 offers a spindle rated at 4.2 kW with a torque of 5.9 N·m and a speed range of 1,000 to 7,000 min⁻¹. A Taiko option is available for the Disco DAG 810.[1]

A grinder removes material from a wafer surface by controlled abrasive action to reduce thickness or prepare the wafer for later processing steps.
A dicing and grinding machine class typically combines backside grinding with wafer singulation-related handling so a wafer can be thinned and prepared for separation in a coordinated flow.
The Disco DAG 810 Automatic fits in wafer thinning and preparation flow.
The Disco DAG 810 Automatic sits in a process sequence that commonly follows frontside fabrication and precedes downstream separation, packaging, or assembly steps.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| DAG 810 with Taiko Option | — | — | Includes Taiko process option | Equipment inventory listing[3] |
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the DAG 810 Automatic are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAG 810 Automatic are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the DAG 810 Automatic are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DAG 810 Automatic are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DAG 810 Automatic is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the DAG 810 Automatic are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 10, 2026.
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