Waferpedia

Comparison ledger

1000 Hot PlateversusHS 20 Diffusion

CEE 1000 Hot Plate, Varian HS 20 Diffusion, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMCEEVarian
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 1000 Hot PlateVarian HS 20 Diffusion
Specifications
Configuration4"[1]—
TypeHot Plate[1]Diffusion pump[3]
Wafer Size4 inch[1]—
Model—HS 20[2]
Cooling method—Water-cooled[3]
Pumping speed, maximum, air—17,500 l/s[4]
Pumping speed, maximum, helium—22,000 l/s[4]
Inlet flange—20" ASA[5]
Foreline flange—ISO63-K[5]
Power—480 VAC, 3-Ø[5]
Oil capacity—4.70 liters[5]
Weight—264 kg[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]manualslib.commanualslib.com
  4. [4]idealvac.comidealvac.com
  5. [5]lesker.comlesker.com