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11000versus4090 Automatic Wafer

Cascade Microtech 11000, Electroglas 4090 Automatic Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
11000Cascade Microtech
4090 Automatic WaferElectroglas
OEMCascade MicrotechElectroglas
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCascade Microtech 11000Electroglas 4090 Automatic Wafer
Cited variants—
  • EG 4090 Automatic Wafer Prober - Nickel Chuck - Hot Chuck Temp - Airblower: IH - Thinwafer - Armsize: IH Bernoulli[1]
  • EG 4090 Automatic Wafer Prober - Nickel Chuck - Hot Chuck Temp - Airblower: IH - Armsize: IH Big[1]
  • EG 4090 Automatic Wafer Prober - Nickel Chuck - Hot Chuck Temp - Armsize: Small[1]
Specifications
ConfigurationWith antivibration table[2]—
Manufacturer—Electroglas[4]
Model—4090[4]
Equipment type—Automatic Wafer Prober[4]
Wafer size support—150 mm (6-inch) and 200 mm (8-inch) wafers[5]
Input voltage—115VAC[5]
Alignment accuracy—Micron-level[5]
Cassette loader—Yes[5]
Display control module—DCM II or DCM-2[5]
Material handler module station—CONT (ESC) or MHCM[5]
Prober control module—Yes[5]
Vision module—PRM-3[5]
Chuck—8 inch hot gold[6]
Options—OCR, cleaning pad[6]
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Sources (6)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]Equipment inventory listing
  5. [5]waferpedia.comwaferpedia.com
  6. [6]jmcserv.comjmcserv.com