Electroglas
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The Electroglas 4090 performs automated wafer loading and unloading, high-precision wafer positioning, probe-to-pad alignment, and electrical contact between probe needles and wafer pads.[4][5][6]
The Electroglas 4090 is configured with a cassette loader, a display control module, a material handler module, a prober control module, and a vision module.[4][3]
The Electroglas 4090 is used for semiconductor wafer sort, parametric testing, R&D and engineering validation, probe card evaluation, and device failure analysis.[5][6][4]
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| EG 4090 Automatic Wafer Prober - Nickel Chuck - Hot Chuck Temp - Airblower: IH - Thinwafer - Armsize: IH Bernoulli | — | 2003–2003 | Variant described with nickel chuck, hot chuck temp, airblower IH, thinwafer, and armsize IH Bernoulli. | waferpedia.com[4] |
| EG 4090 Automatic Wafer Prober - Nickel Chuck - Hot Chuck Temp - Airblower: IH - Armsize: IH Big | — | 2004–2004 | Variant described with nickel chuck, hot chuck temp, airblower IH, and armsize IH Big. | waferpedia.com[4] |
| EG 4090 Automatic Wafer Prober - Nickel Chuck - Hot Chuck Temp - Armsize: Small | — | 2004–2004 | Variant described with nickel chuck, hot chuck temp, and armsize Small. | waferpedia.com[4] |
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The Electroglas 4090 typically supports 150 mm and 200 mm wafers.[4][5][6]
The Electroglas 4090 supports manual, semi-automatic, and fully automatic probing modes.[4][5][6]
The Electroglas 4090 includes automated wafer loading and unloading with a cassette loader.[4][3]
The following facts about the 4090 Automatic Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 4090 Automatic Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 4090 Automatic Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 4090 Automatic Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 4090 Automatic Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 4090 Automatic Wafer are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 4, 2026.
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