Waferpedia

Comparison ledger

Centura DPS 2 Poly Dryversus200 ACU

Applied Materials Centura DPS 2 Poly Dry, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Centura DPS 2 Poly DryApplied Materials
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Centura DPSAxcelis NV GSD 200
Specifications
Configuration300mm DPS Metal chamber with 200mm ESC[1]Parts Machine[2]
Mainframe300mm[1]—
GasO2, CHF3, Ar, CF4, O2/He, He, N2, HBr, CL2, NF3[1]—
OSWindows NT[1]—
Missing23.11.08 1 LL off line[1]—
Manufacturer—Axcelis[2]
Model—200 ACU[2]
Tool type—Asher[2]
Wafer size—200mm[4]
Serial number—AU6A356AH[4]
Computer system—M 200 PC, M 200[5]
Part number—SC 4572 A[5]
Volts—208[5]
Amps—30[5]
Equipment type—Asher[2]
Wafer configuration—8 inch[3]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]wotol.comwotol.com
  5. [5]semistarcorp.comsemistarcorp.com