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Comparison ledger

0010-22161 High EFF RF MatchversusAS 8

Applied Materials 0010-22161 High EFF RF Match, SUSS MicroTec AS 8, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
AS 8SUSS MicroTec
OEMApplied MaterialsSUSS MicroTec
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
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FamilyApplied Materials 0010-22161 High EFF RF MatchSUSS MicroTec AS 8
Specifications
MakeApplied Materials[1]—
Model0010-22161[1]—
DescriptionHTESC PH 1 REV A[2]—
ConditionUsed[2]—
Stock NumberBM6628[2]—
Substrate size (round)—up to 200 mm[3]
Substrate size (square)—up to 6" edge length[3]
Dual-nozzle substrate sizes—Ø150 mm, Ø200 mm[3]
Single-nozzle substrate sizes—Ø3", Ø100 mm, Ø150 mm, Ø200 mm[3]
Z-axis adjustment range—up to 45 mm[3]
Nozzle adjustment range—67.5 mm to 107.5 mm[3]
Spray axis maximum velocity—500 mm/s[3]
Spray axis acceleration—up to 9 m/s²[3]
Chuck maximum rotation speed—1,000 rpm[3]
Heated chuck—optional[3]
Splash-ring design—included[3]
Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]tarasemi.comtarasemi.com
  3. [3]suss.comsuss.com