Waferpedia

Comparison ledger

1511eversus900ACS

Tegal 1511e, Tegal 900ACS, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1511eTegal
900ACSTegal
OEMTegalTegal
CategoryEtchEtch
Wafer sizethree- to six-inch wafers75mm to 200mm wafers
Process node——
Introduced1984—
Production run1984–—
Lifecycle—Legacy
Lifecycle milestones——
Control system——
Generation——
FamilyTegal 1511eTegal 900ACS
Cited variants—
Specifications
tool typetri-electrode dual-frequency plasma etch system[2]single wafer cassette-to-cassette etch system[1]
wafer sizethree- to six-inch wafers[2]—
first sold1984[2]—
system characteristicfirst vacuum-loadlocked dual-frequency tri-electrode etch system[2]—
First vacuum-loadlocked dual-frequency tri-electrode etch systemYes[2]—
process type—non-critical plasma etch[1]
wafer range—75mm to 200mm wafers[1]
series—ACS series[1]
features—faster throughput, faster system calibration, touchscreen graphical user interface, integrated data logging, and factory automation support[1]
throughput—faster throughput[1]
system calibration—faster system calibration[1]
user interface—touchscreen graphical user interface[1]
data logging—integrated data logging[1]
automation support—factory automation support[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org