Waferpedia

Comparison ledger

100 ICP Fluorineversusi90X

Oxford Instruments 100 ICP Fluorine, Tegal i90X, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100 ICP FluorineOxford Instruments
i90XTegal
OEMOxford InstrumentsTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system—Windows NT
Generation——
FamilyOxford Instruments 100 ICP FluorineTegal i90X
Specifications
Etch GasesSF6, CF4, O2, Ar, N2, CHF3, C4F8[1]—
Cryo DRIE etch rateup to 5 µm/min[1]—
Wafer size4 inch, 6 inch, 8 inch (with clamp change)[1]—
Technology—plasma etch technology[2]
Platform—based on the robust, production-proven platform of the 900 series[2]
Footprint—no increase in footprint[2]
Recipes—unlimited recipes[2]
Recipe editor—easy to use screen recipe editor[2]
Stabilization step—configurable, faster stabilization step[2]
Overetch step—programmable percent overetch step[2]
Set-point control—20X fine set-point control for pressure, RF and gas flows[2]
Transport—improved, smooth, faster transport[2]
Stepper motors—high-resolution stepper motors[2]
Motor drivers—intelligent micro-stepping motor drivers[2]
Data logging—default or user-defined values and polling rates; downloadable files to disk or CD; on-screen real time and historical trending; unlimited access to every system I/O data point; additional I/O available for expansion[2]
User interface—GUI touch screen human interface; on-screen end-point trace; I/O screen read-out; on-screen alarm logging; lot and wafer ID[2]
Control system—programmed logic controller (PLC) for input/output speed and expansion; interface board connects to all existing sensors for troubleshooting and maintenance[2]
Control computer—Windows NT, Pentium II 130MB RAM, 230 MHz clock, 6GB hard drive available[2]
Integrated PC—industrial strength integrated PC/touchscreen[2]
Removable media—read-write CD and 3.5 floppy disk[2]
Process steps—Configurable, faster stabilization step; programmable percent overetch step[2]
Wafer transport—High-resolution stepper motors; intelligent micro-stepping motor drivers[2]
I/O control—Programmable logic controller (PLC) for I/O speed and expansion; interface board connects to all existing sensors[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]web.archive.orgweb.archive.org