Comparison ledger
Oxford Instruments 100 ICP Fluorine, Tegal 981ACS, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | 981ACSTegal |
|---|---|---|
| OEM | Oxford Instruments | Tegal |
| Category | Etch | Etch |
| Wafer size | — | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | Tegal 981ACS |
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[1] | — |
| Cryo DRIE etch rate | up to 5 µm/min[1] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[1] | — |
| Wafer size (diameter) | — | 150 mm, 200 mm[2] |
| Wafer size (square) | — | 100 mm square, 6-inch square[2] |
| Reactor type | — | Wide-gap diode (scaled-up version of 901ACS)[2] |
| Applications | — | Non-critical photoresist removal, photoresist trimming, large-scale etching, planarization, backside etching, BioChip nanotechnology[2] |
| Footprint | — | Small; no external rack-mount electronics[2] |
| User interface | — | Intuitive touchscreen interface[2] |
| Maintenance | — | Long-lasting, low maintenance parts[2] |
| Wafer handling | — | Cassette to cassette (no manual handling)[2] |
| Temperature control | — | All electrodes precisely temperature controlled[2] |
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