Waferpedia

Comparison ledger

R10versusMA / BA Gen4 Pro Series

Nikon R10, SUSS MicroTec MA / BA Gen4 Pro Series, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
R10Nikon
OEMNikonSUSS MicroTec
CategoryLithographyLithography
Wafer size150mm150mm
Process node——
Introduced1986—
Production run1973–1979—
LifecycleDiscontinued—
Lifecycle milestones1979 Movie camera business discontinued—
Control system——
Generationi-lineGen4
FamilyNikon R10SUSS MicroTec MA / BA Gen4 Pro Series
Cited variants
  • Nikon R8 SUPER ZOOM[1]
  • BA8 Gen4 ProGen4[2]
Specifications
wafer size150 mm[3]—
exposure wavelengthi-line (365 nm)[3]—
introduced1986[3]—
technology generationi-line[3]—
TypeSilent super 8 cartridge movie camera[4]Semi-automated system[2]
LensCine Nikkor Zoom, f: 1.4, F: 7-70 mm, zooming ratio 10x[4]—
Lens optical construction10-group 14-element zoom lens[1]—
FocusingManual, split image; macro focusing yes[4]—
ZoomingAuto with 2 speeds and manual[4]—
Filter size67 mm[4]—
ViewfinderSingle-lens reflex with adjustable eyepiece; viewfinder information includes aperture scale[4]—
Exposure controlAuto and manual; TTL Electric Eye; EE lock yes; exposure compensation +/-2 stops[4]—
Film speedAuto between 10/16 and 400/650 ASA (daylight/tungsten)[4]—
FilterBuilt-in 85A filter, coupled with movie light socket[4]—
Filming speeds18, 24, 54 fps, single frame[4]—
Shutter opening angleVariable shutter; positions 0°, 40°, 80° and 160°[4]—
FadingAuto and manual fade-in/fade-out[4]—
Rewinding / reverse filming100 frames approx, double exposure and lap dissolve; reverse filming 100 frames approx[4]—
SoundDouble system, sound recording with synchronized tape recorder[4]—
ConnectorsRemote control socket yes; movie light socket Kodak type with filter control; flash synchronization socket yes[4]—
Power source6 x AA batteries only; film drive motor DC micromotor[4]—
Weight1930 g[4]—
Dimensions68 x 260 x 200 mm[4]—
Tripod socket1/4"[4]—
MakerMade in Japan by Nippon Kogaku[4]—
Wafer size—up to 150 mm / 200 mm[2]
Mask alignment—Yes[2]
Bond alignment—Yes[2]
Exposure—Yes[2]
UV bonding—Yes[2]
Fusion bonding—Yes[2]
Micro- and nanoimprinting—Yes[2]
Selective plasma activation—Yes[2]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]imaging.nikon.comimaging.nikon.com
  2. [2]hilpert.chhilpert.ch
  3. [3]en.wikipedia.orgen.wikipedia.org
  4. [4]filmkorn.orgfilmkorn.org