Waferpedia

Comparison ledger

H6-23versusWS-650-15

Laurell H6-23, Laurell WS-650-15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
H6-23Laurell
WS-650-15Laurell
OEMLaurellLaurell
CategorySpin coaterSpin coater
Wafer size150mm300mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation650-series HL650-series
FamilyLaurell H6-23Laurell WS-650-15
Cited variants—
  • WS-650-15 B650-series[1]
  • WS-650-15B650-series[2]
  • WS-650-15 B650-series[3]
Specifications
Maximum rotational speed12,000 RPM (based on a ø 100mm silicon wafer)[4]12,000 RPM (based on a ø 100mm silicon wafer)[1]
Wafer capacityUp to ø 150mm wafers[4]up to ø 300mm wafers[1]
Substrate capacity5" × 5" (127mm × 127mm) substrates[4]9" × 9" (229mm × 229mm) substrates[1]
Power95 to 240VAC, 47/63HZ, ~300 Watts[4]95 to 240VAC, 47/63HZ, ~300 Watts[1]
CategorySpin coater[4]—
Wafer sizeUp to 150 mm wafers[4]—
Substrate size5 in x 5 in (127 mm x 127 mm) substrates[4]—
Speed basisBased on a 100 mm silicon wafer[4]Based on a 100mm silicon wafer[1]
Series650-series HL coater system[4]—
Model—WS-650-15[1]
Configuration—Station mounted[1]
Process controller—650-series process controller[1]
Processes supported—Coating, Etching, Developing, Rinsing-Drying and Cleaning[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org
  3. [3]web.archive.orgweb.archive.org
  4. [4]web.archive.orgweb.archive.org